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    Wiring circuit board and method of manufacturing the same
    7.
    发明专利
    Wiring circuit board and method of manufacturing the same 有权
    接线电路板及其制造方法

    公开(公告)号：JP2013182168A

    公开(公告)日：2013-09-12

    申请号：JP2012046570

    申请日：2012-03-02

    申请人： Nitto Denko Corp ,  日東電工株式会社

    发明人： SHIRAFUJI YOHEI

    IPC分类号： G03F7/20 ,  G03F1/00 ,  G03F1/54 ,  G11B5/60 ,  G11B21/21

    CPC分类号： H05K3/0023 ,  H05K1/02 ,  H05K3/0082 ,  H05K3/445

    摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board in which formation of a hole in an insulation layer during gradation exposure is prevented, and a method of manufacturing it.SOLUTION: By irradiating an insulation layer with exposure light using a photomask 30 having a partial light transmission area 30p configured to partially transmit the exposure light, gradation exposure of the insulation layer is performed. After the gradation exposure, development processing is executed to the insulation layer so as to form a recessed part at the part of the insulation layer irradiated with the exposure light through the partial light transmission area 30p. The partial light transmission area 30p of the photomask 30 includes a plurality of hole parts 30y which the exposure light can go through and a plurality of hole parts 30x which are arranged so as to surround the plurality of hole parts 30y and which the exposure light can go through, and the area of each hole part 30x is larger than the area of each hole part 30y.

    摘要翻译： 要解决的问题：提供一种布线电路板，其中防止在等级曝光期间形成绝缘层中的孔及其制造方法。解决方案：通过使用光掩模30照射具有曝光光的绝缘层，该光掩模30具有 配置为部分地透射曝光光的部分光透射区域30p，进行绝缘层的灰度曝光。 在层叠曝光之后，对绝缘层进行显影处理，以便在通过部分光透射区域30p照射曝光光的绝缘层的部分处形成凹部。 光掩模30的部分光透射区域30p包括曝光光可以穿过的多个孔部30y以及多个孔部30x，该多个孔部30x被配置为包围多个孔部30y，曝光光可以 每个孔部30x的面积比每个孔部30y的面积大。

    Positive photosensitive insulating resin composition, hardened product thereof, and circuit board equipped with the same
    9.
    发明专利
    Positive photosensitive insulating resin composition, hardened product thereof, and circuit board equipped with the same 审中-公开
    阳离子光敏绝缘树脂组合物，其硬化产品和与其相配的电路板

    公开(公告)号：JP2013029862A

    公开(公告)日：2013-02-07

    申请号：JP2012226233

    申请日：2012-10-11

    申请人： Jsr Corp ,  Jsr株式会社

    发明人： SASAKI HIROBUMI ,  ITO JUNJI ,  NISHIOKA TAKASHI ,  GOTO HIROFUMI

    IPC分类号： G03F7/023 ,  G03F7/038 ,  G03F7/38

    CPC分类号： G03F7/0233 ,  G03F7/0388 ,  H01L21/312 ,  H05K3/0023 ,  H05K3/287 ,  H05K3/4676 ,  H05K2201/0212

    摘要： PROBLEM TO BE SOLVED: To provide a photosensitive insulating resin composition capable of forming an interlayer insulating film, a flattening film, a surface protective film, and an insulating film for a high-density mount substrate excelling in properties, such as resolution properties, adherence properties, thermal impact properties, electrical insulation properties, patterning performance and elongation, to provide a hardened product of the photosensitive insulating resin composition, and to provide a circuit board equipped with the hardened product of the photosensitive insulating resin composition.SOLUTION: A positive photosensitive insulating resin composition contains: an alkali-soluble resin; a compound containing a quinonediazide group; and crosslinked resin particles of a particulate copolymer containing 20 to 90 mol% of a constituent derived from a monomer containing a hydroxyl group and/or a carboxyl group.

    摘要翻译： 要解决的问题：提供能够形成层间绝缘膜，平坦化膜，表面保护膜和用于高密度安装基板的绝缘膜的感光绝缘树脂组合物，其特性如分辨率 性能，粘附性能，热冲击性能，电绝缘性能，图案化性能和伸长率，以提供感光绝缘树脂组合物的硬化产品，并提供配备有感光绝缘树脂组合物的硬化产物的电路板。 解决方案：正性感光绝缘树脂组合物含有：碱溶性树脂; 包含醌二叠氮化物基团的化合物; 以及含有20〜90摩尔％的由含有羟基和/或羧基的单体衍生的成分的粒状共聚物的交联树脂粒子。 版权所有（C）2013，JPO＆INPIT