摘要:
PROBLEM TO BE SOLVED: To provide an adhesive tape cutting method capable of improving the accuracy in cutting a support adhesive tape for joining and holding the semiconductor wafer of a ring frame, and to provide an adhesive tape joining apparatus that uses the method. SOLUTION: In a state where a reference plane 62 on the tip side of a cutter holder 43, to which a cutter blade 42 is attached, is brought into contact with a surface of a base material (b) of the supporting adhesive tape DT; the cutter blade cuts the support adhesive tape DT, while making the reference plane of the cutter holder 43 follow the surface of the base material. Here, the cutting edge of the cutter blade 42 is made to pass by a joining interface with the ring frame (f), without making it penetrate an adhesive layer (a). COPYRIGHT: (C)2008,JPO&INPIT
摘要:
In a process of transporting a strip-shaped optical film F, the optical film F is cut to a predetermined length. Thereafter, the sheet-like optical films F divided by the cutting are intermittently transported while the strip-shaped optical film F is fed by the predetermined length such that a portion to be cut next reaches a cutting action position. Further, a leading one of the sheet-like optical films F in the intermittent transport process is transported to a continuous transport process such that a rear end thereof passes the intermittent transport process in a subsequent intermittent transport operation. Herein, the sheet-like optical film F is transported to the downstream-side continuous transport process following the intermittent transport process to continuously transport the optical film F.
摘要:
PROBLEM TO BE SOLVED: To prevent buckling of a sheet end of a sheet subjected to punching processing. SOLUTION: The sheet processing device includes a punch part 706 boring a hole in the end of the sheet, a pushing-out member 509 pushing out the end of the sheet subjected to the punching processing by the punch part 706 and discharging the sheet to a loading means, and a controller controlling the pushing-out member 509. The controller controls the pushing-out member 509 so that the sheet is discharged at a speed lower than a prescribed speed in accordance with punching processing information (a combination of a size and kind of a sheet, and number, shape and size of a hole) that the strength of the sheet end is decreased by the punching processing and it is lower than a prescribed sheet strength dischargeable at the prescribed speed. COPYRIGHT: (C)2011,JPO&INPIT
摘要:
A sheet is cut between a first conveying unit and a second conveying unit in a state in which the first and second conveying units halt and in which an upstream conveying unit conveys the sheet at a first speed; after the sheet is cut, the first conveying unit conveys the sheet at a second speed higher than the first speed to reduce a slack formed during the halting; after the sheet is cut, the second conveying unit conveys the downstream-side sheet at a third speed higher than the first speed; if the third conveying unit is nipping the sheet during cutting, the third conveying unit conveys the sheet at the third speed; and if the third conveying unit is not nipping the sheet, the third conveying unit conveys the sheet at the third speed or a fourth speed after the detecting unit detects the sheet.
摘要:
A sheet processing apparatus, by which a failure in control does not occur even if cutting wastes are conveyed by a conveying unit and an image forming apparatus having the sheet processing apparatus are provided. The sheet processing apparatus has a cutter unit for cutting a sheet, a dust box for accommodating the cutting wastes, a conveying belt pair which conveys the cut sheet, sensors for detecting the sheet conveyed by the conveying belt pair, and a controller for controlling conveyance of the sheet based on the signals detected by the sensors, wherein when the length of the sheet detected by the sensor is equal to or less than a predetermined amount, the controller does not determine the sheet as a sheet.