摘要:
PURPOSE: To provide a non-volatile memory which can reflect one of two logical states on the channel current of a tunnel channel transistor and can arbitrarily rewrite the state into any one of the logical states. CONSTITUTION: By utilizing the fact that a depletion layer formed in a source region 3 to be overlapped with a ferrorelectric layer 6 depends on the polarization state of ferroelectric, when a positive bias is applied to a drain region 4 with respect to the source region 3 to inject electrons from the source region 3 into the drain region 4 via an insulator 5, reading of data depending on the number of electrons emitted from the source region 3 is reflected by the polarization state of the ferroelectric layer 6 under a gate electrode 7. Since the polarization state of the layer 6 is spontaneous, the polarization state can be held (stored) and discriminated (read out) by the channel current of the transistor.
摘要:
[0099] 본발명은강유전체장치의제조방법을기재한다. 방법은적층물을형성하기위해 2개의전도성물질사이에유기중합체강유전체층을위치시키는단계를포함한다. 상기적층물은 2-단계열처리공정을거칠수 있다. 제 1 열처리단계는유기중합체강유전성전구체를강유전성히스테리시스특성을갖는강유전성물질로변환시키고, 제 2 열처리단계는상기강유전성물질을치밀화하여강유전체장치를제조한다. 박막강유전체장치는박막강유전체커패시터, 박막강유전체트랜지스터, 또는박막강유전체다이오드를포함할수 있다.
摘要:
본원은, 플렉서블 비휘발성 메모리 소자용 강유전체 캐패시터, 트랜지스터형 플렉서블 비휘발성 강유전체 메모리 소자, 1T-1R(1Transistor-1Resistor) 플렉서블 강유전체 메모리 소자 및 이들의 제조 방법에 관한 것으로서, 강유전체층과 반도체층 사이의 계면에 고분자 접착층을 형성함으로써 계면에서의 전기적 특성 및 물리화학적 특성을 향상시킬 수 있다.
摘要:
PURPOSE: A nonvolatile memory device and a forming method thereof are provided to improve a data retention property by preventing the deterioration of a memory cell using a metal layer of the same system as a ferroelectric layer. CONSTITUTION: An insulation layer(11) is formed on the upper side of a control gate(10). A metal layer(12) is formed on the upper side of he insulation layer. The insulation layer prevents a short between the metal layer and the control gate of the same metal system. A ferroelectric layer(13) is formed on the upper side of the metal layer. A program and a read gate(14) are formed on the upper side of the ferroelectric layer.
摘要:
A memory device (1) comprises a first semiconductor region (100) having a length, a first surface, and a cross section surrounding the first surface, memory means (300) provided on the first surface, and a gate (400) provided on the memory means (300). The equivalent cross section radius of the cross section of the first semiconductor region (100) is equal to the equivalent silicon oxide film thickness or less of the memory means (300) to realize a low program voltage. Since the equivalent cross section radius r is 10 nm or less, and the gate length is 20 nm or less, the multi-value level interval in terms of the gate voltage can be an eigen value recognizable at room temperatures.
摘要:
A ferroelectric memory device, FET, and methods of manufacturing the same are provided to form the plurality of memory cells within the same region by the inorganic material ferroelectric material or the solid solution and organic compound or the organic compound ferroelectric material as the ferroelectric material. The ferroelectric memory device comprises the substrate(10), and gate electrode(21), the drain(24) and source electrode(25), and the channel forming layer(22) and ferroelectric layer(23). The ferroelectric layer is comprised of the mixture of the organic compound and inorganic material ferroelectric material. The channel forming layer is formed between the gate electrode and ferroelectric layer. The channel forming layer is the organic compound or the inorganic semiconductor layer.