Abstract:
PURPOSE: A method of manufacturing a diamond wire for processing semiconductor materials and a diamond wire manufactured by the same are provided to minimize the contamination of materials due to slurry by employing a diamond wire in which diamond abrasive particles used in multi-wire saw cutting are attached to a wire. CONSTITUTION: A method of manufacturing a diamond wire for processing semiconductor materials comprises steps of: feeding a wire(S1), coating a UV hardener on the surface of a wire(S2), attaching diamond particles to the surface of the wire in which the UV hardener is spread(S3), and hardening the UV hardener(S5). The wire feed step includes a cleaning process for removing organic materials or other foreign substances from the surface of a wire, a heat treatment process for heat-treating the wire at 100°C-130°C, and a surface activation process for passing the wire through diluted acid solution of 5%-20%.
Abstract:
PURPOSE: A wafer surface inspection is provided to improve the accuracy of a surface analysis in wafer by emitting the right which is emitted from a light source of an optical microscope as an angle of incidence of a prescribed range which is not perpendicularity. CONSTITUTION: A supporting plate(10) is located at the lower part of a projection lens of an optical microscope. A search point controlling part(20) is connected to the upper part of the supporting plate. A wafer which inspects a surface is horizontally arranged on the search point controlling part. The search point controlling part controls a search point about a wafer surface of the right which is emitted from the optical microscope through the projection lens. A search angle controlling part(30) is connected to between the search spot controlling part and the supporting plate and controls a search angle about a search spot of the right.
Abstract:
The present invention relates to an alumina sintering furnace structure that sinters high purity alumina used for single crystal growth, and the alumina sintering furnace structure includes: a chamber; a pot furnace for receiving alumina powder to the chamber to conduct the sintering for the alumina powder; heating means having a heating material adapted to emit high temperature heat for the alumina sintering to the pot furnace, the heating material producing the heat if power is supplied thereto by means of a terminal; a first reflection plate adapted to reflect the high temperature heat emitted from the heating means around the heating means onto the pot furnace; and vacuum means connected to the interior of the chamber to maintain the interior of the chamber to a vacuum state and to accelerate the alumina sintering. Accordingly, through the formation of the heating means formed of the heating material made of tungsten or molybdenum and the first reflection plate made of yttria-stabilized zirconia, the alumina powder can be sintered to a high temperature within a short period of time, thus remarkably reducing the work time, improving the productivity and minimizing the production cost, without having any separate high expensive equipment. Further, the alumina powder can be sintered at the high temperature, thus achieving tight tissues to suppress the formation of bubbles acting as a main defect upon the formation of single crystal, improving the purity of the alumina itself to remove the impurities from the single crystal, and providing a high quality aluminum product advantageous to the single crystal growth.
Abstract:
PURPOSE: An apparatus for growing a single crystal is provided to maintain a proper temperature for growing the single crystal in a chamber for growing the single crystal by automatically controlling the flow of cooling water inputted to the chamber. CONSTITUTION: A cooling water manufacturing device(100) constantly controls the temperature of cooling water and discharges the cooling water. A cooling water distributing unit(200) distributes cooling water supplied from the cooling water manufacturing device. A chamber(400) for growing a single crystal includes one or more water cooling tubes. A cooling water supply tube(300) transfers the distributed cooling water to the water cooling tube. A flow control device(320) is buried in the cooling water supply tube.
Abstract:
본 발명에 따른 나노 다이아몬드를 포함하는 표면 연마제 제조 방법 및 이 방법에 의해 제조된 연마제, 그리고 이 연마제를 이용한 연마 방법은, 나노다이아몬드 입자를 이용하여 이를 적절한 용액에 분산 또는 혼합하여 연마제를 제조 구성함으로써, 사파이어, 글래스 및 합성 석영, 실리콘 카바이드, 실리콘 단결정 웨이퍼, 리튬 탄탈레이트 단결정 웨이퍼 등을 연마할 때, 연마 속도를 향상시킬 수 있고, 연마된 표면 조도의 고조도화, 고평탄화를 달성할 수 있는 효과가 있다. 연마제, 웨이퍼, 글래스, 기판, 실리콘, 사파이어, 나노
Abstract:
PURPOSE: A method for manufacturing a polishing pad with nano diamonds, a polishing pad manufactured thereby, and a polishing method using the polishing pad are provided to reduce the amount of polishing slurry because polishing particles and nano diamonds are mixed with polyurethane resin. CONSTITUTION: A method for manufacturing a polishing pad with nano diamonds is as follows. Polishing particles and nano diamonds are uniformly scattered and mixed with polyurethane resin. The mixed materials are injected into a mold and are molded in a specific shape. The molded products are dried in a drying machine. A polishing pad is manufactured by thinly slicing the dried products. The polishing surface of the polishing pad is uniformly trimmed by rapidly rotating a buff. The polishing pad is cut with a specific size.
Abstract:
PURPOSE: A polishing slurry is provided to minimally reduce surface roughness and to improve planarity and to reduce surface roughness of a wafer and plate in polishing. CONSTITUTION: A method for manufacturing a surface abrasive comprises a step of mixing 60~72 wt% colloidal silica(SiO2), 0.5~3 wt% diamond with nano diameter, and 27.5~37 wt% ethylene glycol. A polishing method using a surface abrasive including nanodiamond comprises the steps of: positioning object(S) on a polishing platen(10) and a polishing pad(15); and providing the abrasive on the polishing platen and the polishing pad, an rotating the polishing platen and the polishing pad to polish the object.