Abstract:
본 발명은 반도체 재료 절단용 와이어의 텍스처링 장치에 관한 것으로서, 평판면에 착탈가능하게 결합되는 베이스 플레이트와; 상기 베이스 플레이트의 상부에 안착설치되고, 그 상부에는 상부 보빈틀이 회전가능하게 설치된 하부 플레이트와; 상기 하부 플레이트에 대하여 승강되고, 그 하부에는 상기 상부 보빈틀과 대응되는 하부 보빈틀이 회전가능하게 설치된 상부 플레이트 및; 상기 상부 보빈틀 또는 하부 보빈틀 사이의 와이어 끼움홈에 설치되어 이 끼움홈을 통과하는 와이어에 텍스처링을 하는 다이아몬드 커터를 포함하는 것을 특징으로 하며, 이에 따라 와이어의 표면에 균일한 텍스처링이 이루어짐으로써, 와이어의 표면에 니켈이나 에폭시 등의 부착제와, 다이아몬드 등의 연마입자가 균일하게 코팅되는바, 단선의 우려가 불식되어 와이어의 소모량을 줄이면서도 절단량을 증가시킬 수 있고, 절단시간을 감소시킬 수 있게 되어 대구경의 잉곳도 용이하게 절단시킬 수 있게 되는 매우 유용한 효과가 제공된다.
Abstract:
PURPOSE: A texturing apparatus of a wire for semiconductor material cutting is provided to prevent the occurrence of a disconnection by coating grinding particles in a state of forming texture on the wire. CONSTITUTION: The texturing apparatus of a wire comprises a base plate(20). Connection bolts are installed on the four corners of the base plate. A guide bar is installed on the four corners of the base plate in a vertical direction. A bottom plate(30) installed on the top of the base plate. A top bobbin frame(42) is pivotally installed on the top of the bottom plate. A top plate(40) is ascended and descended corresponding to the bottom plate. A bottom bobbin frame(32) is pivotally installed in the lower part of the top plate. A diamond cutter(60) is installed in a wire fitting groove. The diameter of the diamond cutter is 0.1-0.2mm.
Abstract:
PURPOSE: A method of manufacturing a diamond wire for processing semiconductor materials and a diamond wire manufactured by the same are provided to minimize the contamination of materials due to slurry by employing a diamond wire in which diamond abrasive particles used in multi-wire saw cutting are attached to a wire. CONSTITUTION: A method of manufacturing a diamond wire for processing semiconductor materials comprises steps of: feeding a wire(S1), coating a UV hardener on the surface of a wire(S2), attaching diamond particles to the surface of the wire in which the UV hardener is spread(S3), and hardening the UV hardener(S5). The wire feed step includes a cleaning process for removing organic materials or other foreign substances from the surface of a wire, a heat treatment process for heat-treating the wire at 100°C-130°C, and a surface activation process for passing the wire through diluted acid solution of 5%-20%.
Abstract:
PURPOSE: A wafer surface inspection is provided to improve the accuracy of a surface analysis in wafer by emitting the right which is emitted from a light source of an optical microscope as an angle of incidence of a prescribed range which is not perpendicularity. CONSTITUTION: A supporting plate(10) is located at the lower part of a projection lens of an optical microscope. A search point controlling part(20) is connected to the upper part of the supporting plate. A wafer which inspects a surface is horizontally arranged on the search point controlling part. The search point controlling part controls a search point about a wafer surface of the right which is emitted from the optical microscope through the projection lens. A search angle controlling part(30) is connected to between the search spot controlling part and the supporting plate and controls a search angle about a search spot of the right.