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公开(公告)号：KR1020140083961A
公开(公告)日：2014-07-04
申请号：KR1020140072780
申请日：2014-06-16
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302 , H01L21/78 , H01L21/677
CPC classification number: B32B43/006 , B32B38/10 , H01L21/67051 , H01L21/67092 , H01L21/673 , H01L21/67346 , H01L2221/683 , H01L2221/68304 , H01L2221/68318 , Y10T156/1153 , Y10T156/1168 , Y10T156/1911 , Y10T156/1978 , Y10T156/1994
Abstract: The present invention properly cleans a joining surface of a processed substrate disposed at the inner side of an annular frame and held by the frame and a tape. A cleaning device comprises a wafer holding part (130) holding a processed wafer (W); and a cleaning jig (140) including a supply surface (141) covering a joining surface (Wj) of the processed wafer (W). The cleaning jig (140) is provided with a solvent supply part (150) supplying a solvent to a clearance (142); a rinse liquid supply part (151) supplying a rinse liquid to the clearance (142); and an inactive gas supply part (152) supplying the inactive gas to the clearance (142). The solvent from the solvent supply part (150) is diffused on the joining surface (Wj) due to surface tension and centrifugal force. The rinse liquid from the rinse liquid supply part (151) is diffused on the joining surface (Wj) due to surface tension and centrifugal force while being mixed with the solvent. The joining surface (Wj) is dried by an inactive gas from the inactive gas supply part (152) and the joining surface (Wj) is cleaned.
Abstract translation: 本发明适当地清洁设置在环形框架的内侧并被框架和带子保持的处理基板的接合表面。 清洁装置包括保持处理过的晶片（W）的晶片保持部（130）。 以及包括覆盖处理过的晶片（W）的接合面（Wj）的供给面（141）的清洁夹具（140）。 清洁夹具（140）设有向间隙（142）供应溶剂的溶剂供应部件（150）。 向所述间隙（142）提供冲洗液体的冲洗液供给部（151）; 以及将惰性气体供给到间隙（142）的惰性气体供给部（152）。 来自溶剂供给部（150）的溶剂由于表面张力和离心力而扩散在接合面（Wj）上。 在与溶剂混合的同时，由于表面张力和离心力，来自冲洗液供给部（151）的冲洗液在接合面（Wj）上扩散。 接合面（Wj）由来自惰性气体供给部（152）的惰性气体干燥，并且清洁接合面（Wj）。
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公开(公告)号：KR100919069B1
公开(公告)日：2009-09-28
申请号：KR1020047005593
申请日：2002-10-22
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/324
CPC classification number: H01L21/67109
Abstract: A heat treatment apparatus configured to perform heat treatment on a wafer having a surface on which a coating film is formed, and includes: a holding member for holding the wafer almost horizontally; a chamber for housing the wafer held by the holding member; a hot plate having gas permeability and disposed above the wafer held by the holding member in the chamber so that the coating film formed on the wafer can be directly heated; and an exhaust port provided on the top face of the chamber and exhausting gas in the chamber. Gas generated from the coating film passes through the hot plate and is exhausted from the chamber. Accordingly, uniformity of a coating film is improved. As a result, CD uniformity may be improved, LER characteristics may be improved, and a smooth pattern side face may be obtained.
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公开(公告)号：KR1020120052871A
公开(公告)日：2012-05-24
申请号：KR1020110118431
申请日：2011-11-14
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: G02F1/13 , H01L21/324
CPC classification number: G02F1/1313 , H01L21/324 , H01L21/67098
Abstract: PURPOSE: A heating device is provided to increase a processing speed without damage of a substrate even though the substrate is a large glass substrate. CONSTITUTION: A plurality of upper planar heating units(81) are arranged on a return route. A plurality of lower planar heating units are arranged on a lower part of the return route. Some upper and lower planar heating units are classified according to the return direction of the return route. Some upper and lower planar heating units are classified into a central part and both ends in the width direction of the return route. Both ends are controlled at a lower temperature than the temperature of the classified central part.
Abstract translation: 目的：提供一种加热装置，以增加处理速度而不损坏基板，即使基板是大玻璃基板。 构成：在返回路线上布置有多个上平面加热单元（81）。 多个下平面加热单元布置在返回路线的下部。 一些上下平面加热单元根据返回路线的返回方向进行分类。 一些上下平面加热单元被分为在返回路线的宽度方向上的中心部分和两端。 两端控制在比分类的中央部分的温度低的温度。
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公开(公告)号：KR1020010015371A
公开(公告)日：2001-02-26
申请号：KR1020000041330
申请日：2000-07-19
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/324
Abstract: PURPOSE: A substrate heating device and a method for controlling a temperature are provided to change rapidly a temperature of a heating plate by improving a structure of a substrate heating device. CONSTITUTION: A heating plate(51) performs an operation for heating a substrate. A heater(52) is installed within the heating plate(51). The heater(52) performs a heating process for the substrate. A cooling plate(55) performs a cooling process for the heating plate(51). The cooling plate(55) is formed with a coolant path(56,57) and a coolant supply portion(60). A control portion(66) controls the heater and the cooling plate. The control portion(66) controls a temperature of the heating plate according to a predetermined temperature.
Abstract translation: 目的：提供一种基板加热装置和控制温度的方法，通过改善基板加热装置的结构来快速改变加热板的温度。 构成：加热板（51）进行加热基板的动作。 加热器（52）安装在加热板（51）内。 加热器（52）对基板进行加热处理。 冷却板（55）对加热板（51）进行冷却处理。 冷却板（55）形成有冷却剂路径（56,57）和冷却剂供应部分（60）。 控制部分（66）控制加热器和冷却板。 控制部（66）根据预定温度控制加热板的温度。
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公开(公告)号：KR1020120026457A
公开(公告)日：2012-03-19
申请号：KR1020110091125
申请日：2011-09-08
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/677 , B65G49/06 , G02F1/13
CPC classification number: H01L21/67706 , B65G49/061 , B65G49/067 , G02F1/1303 , H01L21/67715
Abstract: PURPOSE: A substrate transfer apparatus and a substrate transfer method are provided to transfer a substrate in stable by supporting a substrate by a drive roller row and a free roller row in transferring the substrate. CONSTITUTION: The drive shaft(55) revolves with the drive of the drive motor(51) at the sending direction of substrate. A drive shaft(55) rotates a substrate in transferring direction of a substrate by the drive motor. A rotation shaft is connected to the drive motor in parallel with the transfer direction of the substrate. A gear comprised of a bevel gear is mounted in the rotation shaft. A gear(54) consisting of the bevel gear is installed in one end of the drive shaft. A free roller shaft(57) is connected to a cylinder for driving the free roller.
Abstract translation: 目的：提供基板转印装置和基板转印方法，以通过驱动辊排和自由辊排支撑基板来稳定地转印基板，从而转印基板。 构成：驱动轴（55）随着驱动电动机（51）的驱动沿基板的发送方向旋转。 驱动轴（55）通过驱动马达在基板的传送方向上旋转基板。 旋转轴与基板的传送方向平行地连接到驱动马达。 由伞齿轮构成的齿轮安装在旋转轴中。 由伞齿轮构成的齿轮（54）安装在驱动轴的一端。 自由辊轴（57）连接到用于驱动自由辊的气缸。
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Patent Agency Ranking
公开(公告)号：KR1020070061418A
公开(公告)日：2007-06-13
申请号：KR1020060123948
申请日：2006-12-07
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027 , H01L21/324
CPC classification number: H01L21/67109 , H01L21/67173 , H01L21/67207
Abstract: A heat treatment apparatus is provided to restrain the damage of a large sized substrate and to reduce the size of the apparatus by using a transfer path enclosed with a casing and first/second sheet type heaters. A heat treatment apparatus includes a transfer path for transferring a substrate to one way, a casing, and first and second sheet type heaters. The casing(6) is used for enclosing the transfer path. The first and second sheet type heaters(71a to 71r, 72a to 72r) are arranged along the transfer path in the casing. The first and second sheet type heaters are installed adjacent to both sides of the substrate. The transfer path is composed of a plurality of rotator members spaced apart from each other. The first and second sheet type heaters are installed at portions between the rotator members.
Abstract translation: 提供一种热处理装置，用于限制大尺寸基板的损坏，并且通过使用由壳体和第一/第二片式加热器封装的传送路径来减小设备的尺寸。 热处理设备包括用于将衬底转移到单向的传送路径，壳体以及第一和第二片状加热器。 壳体（6）用于封闭传送路径。 第一和第二片式加热器（71a至71r，72a至72r）沿壳体中的传送路径布置。 第一和第二片式加热器安装在基片的两侧附近。 传送路径由彼此间隔开的多个旋转体构件构成。 第一和第二片式加热器安装在旋转件之间的部分。
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公开(公告)号：KR100655528B1
公开(公告)日：2006-12-08
申请号：KR1020000041330
申请日：2000-07-19
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/324
Abstract: 본 발명은, 기판가열처리장치 및 온도제어방법에 관한 것으로서, 웨이퍼에 베이킹 처리를 실시하기 위한 가열 플레이트 내에 상기 가열 플레이트를 승온시키기 위한 히터가 설치되고, 또한, 상기 가열 플레이트 내에 내부를 흐르는 냉각매체에 의해 가열 플레이트를 강온(降溫)시키기 위한 냉각매체로가 형성되어 있으며, 가열 플레이트의 설정온도를 강온시키는 경우, 냉각매체가 냉각매체로에 공급되어 가열 플레이트가 설정온도 이하로까지 일단 강온되고, 그 후 히터에 의해 설정온도까지 승온되어짐으로써, 가열 플레이트의 온도를 신속하게 새로운 설정온도로 변경시킬 수 있음과 동시에, 온도의 면내 균일성을 양호하게 유지할 수 있는 기술이 제시된다.
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公开(公告)号：KR101269748B1
公开(公告)日：2013-05-30
申请号：KR1020060123948
申请日：2006-12-07
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027 , H01L21/324
Abstract: 본발명은가열처리장치에관한것으로서가열처리장치 (28)은기판 (G)를한방향으로반송하는반송로로서의롤러반송기구 (5)와반송로를포위하도록설치된케이싱 (6)과케이싱 (6)내에반송로를반송되는기판 (G)의양면측에기판 (G)에근접하도록반송로를따라각각설치된제1 및제2의면형상히터 (71a~71r, 72a~72r)를구비하여기판이대형으로서도기판의휘어짐이나파손등의발생을억제할수가있는것과동시에기판을수용하는케이싱의소형화를도모하는것이가능한가열처리장치를제공한다.
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公开(公告)号：KR1020130007480A
公开(公告)日：2013-01-18
申请号：KR1020120070940
申请日：2012-06-29
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302
CPC classification number: B32B43/006 , B32B38/10 , H01L21/67051 , H01L21/67092 , H01L21/673 , H01L21/67346 , H01L2221/683 , H01L2221/68304 , H01L2221/68318 , Y10T156/1153 , Y10T156/1168 , Y10T156/1911 , Y10T156/1978 , Y10T156/1994
Abstract: PURPOSE: A cleaning method, a computer storage medium, a cleaning device, and a detaching system are provided to properly clean a contact surface of a target substrate by arranging the target substrate detached from laminated substrates in an annular frame. CONSTITUTION: A cleaning device comprises a wafer maintaining part(130) and a cleaning jig(140). The cleaning jig comprises a supply surface(141) covering a contact surface(WJ) of a target wafer. The cleaning jig comprises a solvent supply part(150), rinse supply part, and an inner gas supply part(152). The solvent supply part supplies the solvent of adhesives in a gap between the supply surface and the contact surface.
Abstract translation: 目的：提供一种清洁方法，计算机存储介质，清洁装置和分离系统，以通过将目标基板从叠层基板分离成环形框架来适当地清洁目标基板的接触表面。 构成：清洁装置包括晶片保持部分（130）和清洁夹具（140）。 清洁夹具包括覆盖目标晶片的接触表面（WJ）的供给表面（141）。 清洁夹具包括溶剂供应部分（150），冲洗供应部分和内部气体供应部分（152）。 溶剂供应部分在供给表面和接触表面之间的间隙中提供粘合剂的溶剂。
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公开(公告)号：KR1020120064623A
公开(公告)日：2012-06-19
申请号：KR1020110129596
申请日：2011-12-06
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027 , G03F7/26
CPC classification number: G03F7/265 , G03F1/60 , G03F7/202 , H01L21/0274
Abstract: PURPOSE: A heat processing apparatus and a coating and developing apparatus are provided to uniformly heat a substrate by controlling air current through a suction port. CONSTITUTION: A heater heats a substrate carried within a case(6) by a first carrier apparatus. An exhaust port is installed in the case. The exhaust port forms air current reaching to the exhaust port from a first carrying in port and a first carrying out port. The suction port is installed in either the first carrying in port or the first carrying out port or both parties. The suction port adjusts the air current with suction.
Abstract translation: 目的：提供热处理设备和涂覆和显影设备以通过控制通过吸入口的气流来均匀地加热基板。 构成：加热器通过第一载体装置加热壳体（6）内承载的基板。 排气口安装在箱体内。 排气口形成从第一输送口和第一输送口到达排气口的气流。 吸入口安装在第一个运输港口或第一个运输港口或双方。 吸入口通过吸力调节气流。
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