公开(公告)号：KR200486098Y1

公开(公告)日：2018-04-03

申请号：KR2020160007117

申请日：2016-12-07

申请人： 주식회사 유라코퍼레이션

发明人： 윤종훈 ,  이승훈

IPC分类号： H01R43/00

CPC分类号： H01R43/00 ,  Y10S269/903

摘要： 본고안의커넥터안착지그는, 와이어링하네스가설치되어서브작업이이루어지는커넥터가안착되는안착홈을포함하는제1 바디와, 상기제1 바디하측에위치하는제2 바디및 상기제1 및제2 바디사이에설치되어상기제1 바디가승강하며상기제1 바디의높이가조절되는승강부를포함하는것을특징으로한다.

公开(公告)号：KR1020050081481A

公开(公告)日：2005-08-19

申请号：KR1020040009733

申请日：2004-02-13

申请人： 삼성전자주식회사

发明人： 이석원 ,  안병일 ,  강동우 ,  김기현 ,  권대갑 ,  김동민

IPC分类号： H01L21/68

CPC分类号： H02N2/0095 ,  Y10S269/903

摘要： 본 발명은, 제1스테이지와, 상기 제1스테이지에 대해 이동가능하게 마련된 제2스테이지를 구비한 스테이지장치에 관한 것으로서, 상기 제1스테이지 및 상기 제2스테이지를 연결하는 적어도 하나의 플렉쳐힌지와; 상기 제1스테이지 및 상기 제2스테이지 사이에 마련되어 상기 제1스테이지 및 상기 제2스테이지를 가압하며, 상기 제1스테이지 및 상기 제2스테이지의 중심에 대해 대칭을 이루도록 마련된 복수의 액추에이터와; 상기 제1스테이지 및 상기 제2스테이지 중 어느 하나에 대한 다른 하나의 이동을 조절하도록 상기 복수의 액추에이터를 제어하는 제어부를 포함하는 것을 특징으로 한다. 이에 의하여, 초정밀의 위치제어가 가능하도록 위치오차를 용이하게 줄일 수 있다.

公开(公告)号：KR1020050030622A

公开(公告)日：2005-03-30

申请号：KR1020047012442

申请日：2003-08-05

申请人： 파나소닉 주식회사

发明人： 오니츠카,야수토 ,  니시나카,테루아키

IPC分类号： H05K13/02

CPC分类号： H01L21/6835 ,  H01L23/4985 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/0097 ,  H05K13/0069 ,  H05K2203/0156 ,  H05K2203/167 ,  Y10S269/903 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53265 ,  Y10T29/53978

摘要： To provide a transfer carrier for a flexible printed circuit board and an electronic parts mounting method on a flexible printed circuit board which can cope with different mounting methods by using the same transfer carrier. A carrier 10 is configured in a manner that back-up opening portions 10e which pass therethrough back- up portions for bonding semiconductor devices and reference pin opening portions 10c which pass therethrough reference pins 15 for positioning boards 1 are provided at a base plate 11 on which a resin layer 12 having a surface to be adhered to the board 1. Then, the carrier 10 is positioned to an attachment jig 13 by means of positioning pins 14. Thus, the reference pins 15 are positioned at the reference pin opening portions 10c and the reference holes la are positioned at the reference pins 15 thereby to adhere the board 1 to the resin layer 12. As a result, the boards can be held adhesively on the carrier in a state that the boards 1 are positioned, whereby the same transfer carrier can cope with the different mounting methods.

摘要翻译： 在柔性印刷电路板上提供用于柔性印刷电路板的转印载体和电子部件安装方法，其可以通过使用相同的转印载体来处理不同的安装方法。 载体10被构造成使得穿过用于接合半导体器件的备用部分的支撑开口部分10e和穿过用于定位板1的基准销15的基准销开口部分10c设置在基板11上 该树脂层12具有要粘附到板1的表面。然后，载体10通过定位销14定位到附接夹具13上。因此，参考销15位于基准销开口部分10c 并且参考孔1a位于参考销15处，从而将板1粘附到树脂层12.结果，可以在板1定位的状态下将板粘附在载体上，由此相同 转运架可以应付不同的安装方式。

公开(公告)号：KR100454977B1

公开(公告)日：2004-11-06

申请号：KR1020027000647

申请日：2000-07-17

申请人： 지멘스 악티엔게젤샤프트

发明人： 뒤벨,라이너

IPC分类号： H05K13/04

CPC分类号： H05K13/0069 ,  Y10S269/903 ,  Y10T29/53191 ,  Y10T29/53265 ,  Y10T29/53396 ,  Y10T29/53961

摘要： Substrates are supported by height-adjustable supporting pins in automated equipping units. The supporting pins are composed of a tip and a foot part that is spring-borne relative to the tip. When the supporting pins are placed against an underside of the substrate, the supporting pins individually adapt to the contour of the underside of the substrate. The height position of the supporting pins is subsequently fixed. As a result, substrates having position and surface variations can be protected against sagging upon placement of components on the substrates during an automated equipping process.

摘要翻译： 基材由自动装配单元中的高度可调支撑销支撑。 支撑销由相对于尖端弹簧承载的尖端和脚部构成。 当支撑销抵靠基板的下侧放置时，支撑销单独地适应基板下侧的轮廓。 随后固定支撑销的高度位置。 结果，具有位置和表面变化的基板可以在自动化装配过程期间在将部件放置在基板上时防止下垂。

公开(公告)号：KR100422444B1

公开(公告)日：2004-03-12

申请号：KR1020010029656

申请日：2001-05-29

申请人： 삼성전자주식회사

发明人： 이선영

IPC分类号： H01L21/68

CPC分类号： H01L21/6831 ,  Y10S269/903 ,  Y10T279/23

摘要： A wafer space supporting apparatus is installed on a support chuck to relieve physical stress caused by thermal expansion or contraction of an object to be fabricated and adjusts itself to support the object to compensate for thermal expansion and contraction as well as minimize hard defects generated. The wafer space supporting apparatus includes a plurality of sliding pockets sunken into the supporting surface of the chuck, and sliding pads respectively floating-coupled in the sliding pockets such that they are spaced apart from the supporting surface so that they may adapt to expansions and contractions of an object to be fabricated, thereby preventing or minimizing any hard defects or physical stress.

摘要翻译： 晶圆空间支撑装置安装在支撑卡盘上，以缓解由待制造物体的热膨胀或收缩引起的物理应力，并调节自身以支撑物体以补偿热膨胀和收缩，并最小化产生的硬缺陷。 晶片空间支撑装置包括沉入卡盘的支撑表面中的多个滑动凹座，以及分别浮动耦合在滑动凹座中的滑动垫，使得它们与支撑表面间隔开，使得它们可适应扩展和收缩 的要制造的物体，从而防止或最小化任何硬质缺陷或物理应力。

公开(公告)号：KR1020030067721A

公开(公告)日：2003-08-14

申请号：KR1020037008619

申请日：2001-12-26

申请人： 에스엔에쎄엠아 프로폴지옹 솔리드

发明人： 모뮈,쟝-삐에르 ,  샤떼네,쎄르쥬

IPC分类号： F27D5/00

CPC分类号： F27D5/00 ,  C21D9/0025 ,  Y10S269/903

摘要： 본 발명은 부품(3)의 열처리를 위해서, 특히 철강부품의 고결를 위한 지지못(2)이 안내부재(221)를 구비하는 것을 특징으로 하는데, 이 안내부재(221)는 부품이 지지슬러그상에 위치될 때 지지못(2)의 지지면(230)을 향하여 부품(3)을 안내하도록 되어 있으며, 지지면(230)은 지지슬러그의 금속본체(20)에 끼워넣어진 세라믹부재로 형성되어 있는 것을 특징으로 한다.

公开(公告)号：KR1020020015966A

公开(公告)日：2002-03-02

申请号：KR1020010050801

申请日：2001-08-22

申请人： 도쿄엘렉트론가부시키가이샤

发明人： 사카타가즈나리 ,  하세가와고유 ,  가타부치게이이치 ,  와타나베신고 ,  모치즈키신야 ,  아키모토모토키 ,  모토노히로시

IPC分类号： H01L21/324

CPC分类号： H01L21/67373 ,  F27B5/04 ,  F27B17/0025 ,  F27D3/0084 ,  F27D5/0037 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67379 ,  H01L21/67389 ,  H01L21/67393 ,  H01L21/67739 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/68707 ,  Y10S269/903 ,  Y10S414/135 ,  Y10S414/137

摘要： PURPOSE: A vertical heat treatment system is provided to be capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area, and of contributing to space saving, when an object to be treated is carried in the vertical heat treatment system through the opening to carry out a predetermined treatment. CONSTITUTION: In a vertical heat treatment system for carrying an object(W) to be treated, which is housed in a treating-object housing box(2) closed by an opening/closing lid(10), in a treating-object transfer area(46) via an opening(28), which is formed in a partition wall(26) separating a housing-box transfer area(44) for transferring the treating-object housing box from the treating-object transfer area(46) in an atmosphere of an inert gas, to carry out a predetermined treatment, a standby box transfer unit(60) is provided in the housing-box transfer area for holding a treating-object housing box, which houses therein the next object to be carried in the treating-object transfer area, in the vicinity of the opening to cause the treating-object housing box to stand by.

摘要翻译： 目的：提供一种立式热处理系统，能够简化形成在将箱体转移区域从处理对象转移区域分隔开的分隔壁上的开口附近的各种机构的结构， 为了节省空间，当通过开口在垂直热处理系统中承载待处理物体时，进行预定处理。 构成：在用于承载待处理物体（W）的立式热处理系统中，所述物体（W）被容纳在由打开/关闭盖（10）封闭的处理对象收纳箱（2）中的处理对象传送区域 （46），其形成在分隔用于将处理对象收容箱从处理对象转移区域（46）传送的容纳箱传送区域（44）的分隔壁（26）中， 惰性气体的气氛中进行预定的处理，备箱传送单元（60）设置在容纳箱传送区域中，用于保持处理对象收纳盒，其中容纳有待携带的下一个物体 处理对象转移区域，在开口附近使处理对象收纳箱待机。

公开(公告)号：KR1019940002761B1

公开(公告)日：1994-04-02

申请号：KR1019900016688

申请日：1990-10-19

申请人： 가부시키가이샤 신가와

发明人： 야마사끼노부또

IPC分类号： H01L21/60 ,  B21F15/00

CPC分类号： H01L24/85 ,  H01L21/6835 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H05K13/06 ,  Y10S269/903 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： 내용 없음.

公开(公告)号：KR2019920003641Y1

公开(公告)日：1992-06-01

申请号：KR2019890011941

申请日：1989-08-12

申请人： 스미도모덴소오가부시기가이샤

发明人： 후꾸다미찌오 ,  이이다쯔도무 ,  이시가와요시히데 ,  이구라히로시 ,  다까하시쯘네요시 ,  아베기요히데 ,  가시하라이사오

IPC分类号： G06T1/00

CPC分类号： G06T7/0006 ,  G06T2207/10016 ,  G06T2207/30164 ,  Y10S269/903 ,  Y10T29/53022

摘要： 내용 없음.

公开(公告)号：KR1019900006485B1

公开(公告)日：1990-09-01

申请号：KR1019870009217

申请日：1987-08-24

申请人： 에이엠 피 인코포레이티드

发明人： 디미트리지이.그래브 ,  아이오시프코선스키

IPC分类号： H01L21/00

CPC分类号： H01L21/67333 ,  G01R1/0425 ,  G01R31/2893 ,  Y10S269/903

摘要： The workholder is configured in a flat plate having a top surface and a bottom surface which is parallel to the top surface. The top surface is spaced a distance from the bottom surface, such that the distance between the top surface and the bottom surface does not exceed a distance between an upper surface and a lower surface of an individual substrate. A number of substrate receiving openings extend through the plate, each opening being dimensioned to receive a respective substrate in it. A biasing spring adjacent to each opeing biases a substrate in the opening. The biasing spring is between the top and bottom surfaces of the workholder and does not extend beyond its top and bottom surfaces.

摘要翻译： 夹持器构造成具有顶表面和与顶表面平行的底表面的平板。 顶表面与底表面间隔一定距离，使得顶表面和底表面之间的距离不超过单个基底的上表面和下表面之间的距离。 多个基板接收开口延伸穿过板，每个开口的尺寸被设计成在其中接收相应的基板。 邻近每个开口的偏置弹簧偏压开口中的基底。 偏置弹簧位于夹持器的顶表面和底表面之间，并且不延伸超出其顶部和底部表面。