专利检索 cpc:"H01L2224/81711" 第 1 页

1.

发明专利
導電性接合材料、接合導體之方法、及製造半導體裝置之方法 ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
简体标题：导电性接合材料、接合导体之方法、及制造半导体设备之方法 ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

公开(公告)号：TW201244867A

公开(公告)日：2012-11-16

申请号：TW101103537

申请日：2012-02-03

申请人： 富士通股份有限公司

发明人： 山上高豊 , 久保田崇 , 石川邦子 , 北嶋雅之

IPC分类号： B23K , H05K

CPC分类号： H01L24/13 , B22F1/0014 , B22F1/025 , B23K35/262 , B23K35/30 , B23K35/3006 , B23K35/3013 , B23K35/302 , C22C9/00 , C23C24/106 , H01L23/49811 , H01L23/49883 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/0568 , H01L2224/05686 , H01L2224/1131 , H01L2224/1132 , H01L2224/11502 , H01L2224/13017 , H01L2224/13144 , H01L2224/13599 , H01L2224/13609 , H01L2224/13611 , H01L2224/13613 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13709 , H01L2224/13711 , H01L2224/13713 , H01L2224/13809 , H01L2224/13811 , H01L2224/13813 , H01L2224/13839 , H01L2224/13844 , H01L2224/13847 , H01L2224/13899 , H01L2224/13913 , H01L2224/13939 , H01L2224/13944 , H01L2224/13947 , H01L2224/16058 , H01L2224/16148 , H01L2224/16225 , H01L2224/16507 , H01L2224/32225 , H01L2224/73204 , H01L2224/81024 , H01L2224/81055 , H01L2224/81075 , H01L2224/81191 , H01L2224/81193 , H01L2224/812 , H01L2224/8121 , H01L2224/8123 , H01L2224/81509 , H01L2224/81511 , H01L2224/81513 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81699 , H01L2224/81711 , H01L2224/81713 , H01L2224/81739 , H01L2224/81744 , H01L2224/8181 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/13091 , H01L2924/15738 , H01L2924/15788 , H01L2924/1579 , H01L2924/01007 , H01L2924/01008 , H01L2924/01018 , H01L2924/01083 , H01L2924/01031 , H01L2924/0103 , H01L2924/053 , H01L2224/13099 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00

摘要： 一種導電性接合材料包括：由高熔點金屬顆粒、中熔點金屬顆粒及低熔點金屬顆粒形成之金屬組份，高熔點金屬顆粒具有第一熔點或更高；中熔點金屬顆粒具有第一溫度或更高且第二溫度或更低之第二熔點，該第二溫度低於該第一熔點且高於該第一溫度；低熔點金屬顆粒具有第三熔點或更低，該第三熔點低於該第一溫度。

简体摘要： 一种导电性接合材料包括：由高熔点金属颗粒、中熔点金属颗粒及低熔点金属颗粒形成之金属组份，高熔点金属颗粒具有第一熔点或更高；中熔点金属颗粒具有第一温度或更高且第二温度或更低之第二熔点，该第二温度低于该第一熔点且高于该第一温度；低熔点金属颗粒具有第三熔点或更低，该第三熔点低于该第一温度。