Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive

    公开(公告)号:US11626133B1

    公开(公告)日:2023-04-11

    申请号:US17709402

    申请日:2022-03-30

    IPC分类号: G11B5/48 G11B5/00

    摘要: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which a solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size smaller than a wiring gap between an electrode surface of the laser diode and the flexure, and being in melted-particle condition.

    Thin-film piezoelectric-material element, method of manufacturing the same, head gimbal assembly and hard disk drive

    公开(公告)号:US11411162B2

    公开(公告)日:2022-08-09

    申请号:US16503494

    申请日:2019-07-04

    摘要: A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface. The lower piezoelectric-material protective-film, and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo, by Ion beam deposition.

    Suspension assembly of optical image stabilizer

    公开(公告)号:US11347075B2

    公开(公告)日:2022-05-31

    申请号:US16731651

    申请日:2019-12-31

    IPC分类号: G02B27/64 H04N5/232 G02B7/02

    摘要: The present invention relates to the field of camera shake reduction technology and discloses a suspension assembly of OIS, which comprises a printed circuit board and a spring plate movably disposed on the printed circuit board, wherein the printed circuit board is electrically connected with the spring plate, the printed circuit board comprises a substrate plate and a bend portion extending downwards along any side edge of the substrate plate, a support component is attached to a bottom surface of the substrate plate, a plurality of conductive terminals are arranged on an outside surface of the bend portion, a plurality of reinforce components are arranged on an inside surface of the bend portion and corresponding to the plurality of conductive terminals one to one, and the plurality of reinforce components are placed at intervals and do not contact with each other.

    High power ratio mode for TAMR drives

    公开(公告)号:US10679653B1

    公开(公告)日:2020-06-09

    申请号:US16296366

    申请日:2019-03-08

    摘要: A method of operating a HDD having a read/write head configured for Perpendicular Magnetic Recording (PMR) and configured for use in Thermally Assisted Magnetic Recording (TAMR). By using selected settings of a power ratio (PR) value to ensure that accurate fly height (FH) measurements of head-disk interference (HDI) can be taken during write touchdowns (TDs), head damage can be eliminated during HDI events. Under normal operating conditions the PMR head develops a sharp protrusion due to heating from the TAMR apparatus as well as the write current and read and write heaters. The sharp protrusion is prone to striking the disk surface, instead of the shields doing so. The shields would be more capable of absorbing the HDI, which would allow the HDI sensors (HDIs) to provide a more sensitive reading of the HDI which would prevent head wear caused by the sharp protrusion. By adjusting the power ratio (PR) to be at least the turning point (TP) value, the write shield will approach the disk surface before the sharp protrusion.

    Voice coil motor
    10.
    发明授权

    公开(公告)号:US10205371B2

    公开(公告)日:2019-02-12

    申请号:US15082228

    申请日:2016-03-28

    IPC分类号: H02K41/035 G02B7/08

    摘要: A voice coil motor includes a housing having a cavity; a movable assembly received in the cavity; a fixing assembly configured outside of the movable assembly; and a first spring plate and a second spring plate configured at an upper surface and a lower surface of the movable assembly respectively. The fixing assembly comprises at least two magnetic elements connected with the first spring plate and a spacer member configured on the second spring plate to connect the second spring plate to the magnetic elements or the housing. The voice coil motor is served as an actuator of electronic products such as digital cameras, mobile phones, and digital cameras, which has thin thickness, good performance and strong applicability.