公开(公告)号：US20110012261A1

公开(公告)日：2011-01-20

申请号：US12923453

申请日：2010-09-22

申请人： Jin-Won Choi ,  Chang-Suo Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

发明人： Jin-Won Choi ,  Chang-Suo Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

IPC分类号： H01L23/48

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/02 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0568 ,  H05K2203/0571 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： A post bump formed over an electrode pad of a substrate for electrically connecting to an external device, the post bump including a metal post formed over the electrode pad; and a solder formed over the metal post and shaped as a dome, the dome occupying a space defined by imaginary lines extending from a perimeter of the metal post along an axial direction of the metal post.

摘要翻译： 在用于电连接到外部装置的基板的电极焊盘上形成的凸块，所述柱凸起包括形成在所述电极焊盘上的金属柱; 以及形成在所述金属柱上并形成为圆顶的焊料，所述圆顶占据由沿所述金属柱的轴向方向从所述金属柱的周边延伸的假想线限定的空间。