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    Optical system for a laser printer
    2.
    发明授权
    Optical system for a laser printer 失效
    激光打印机的光学系统

    公开(公告)号：US5521999A

    公开(公告)日：1996-05-28

    申请号：US214936

    申请日：1994-03-17

    Applicant: Chih-Li Chuang ,  Andrew F. Kurtz

    Inventor： Chih-Li Chuang ,  Andrew F. Kurtz

    IPC: B41J2/44 ,  B41J2/47 ,  G02B6/42 ,  G02B26/10

    CPC classification number: G02B6/4206 ,  B41J2/471

    Abstract: An optical system for a laser printer. The optical system includes a diode laser for producing a laser beam at a predetermined wavelength for scanning across a photosensitive media. A single mode fiber is connected to the diode laser for transmitting the beam from the diode laser to an object plane.

    Abstract translation: 一种用于激光打印机的光学系统。 光学系统包括用于产生预定波长的激光束以用于扫描光敏介质的二极管激光器。 单模光纤连接到二极管激光器，用于将光束从二极管激光器传输到物体平面。

    Semiconductor wafer bonding incorporating electrical and optical interconnects
    5.
    发明授权
    Semiconductor wafer bonding incorporating electrical and optical interconnects 有权
    包含电和光互连的半导体晶片接合

    公开(公告)号：US08912017B2

    公开(公告)日：2014-12-16

    申请号：US13463130

    申请日：2012-05-03

    Applicant: Hussein S. El-Ghoroury ,  Chih-Li Chuang ,  Kameshwar Yadavalli ,  Qian Fan

    Inventor： Hussein S. El-Ghoroury ,  Chih-Li Chuang ,  Kameshwar Yadavalli ,  Qian Fan

    IPC: H01L21/00 ,  H01L21/18 ,  H01L27/146

    CPC classification number: H01L33/0079 ,  H01L21/187 ,  H01L27/14618 ,  H01L27/14683 ,  H01L33/0066 ,  H01L33/0095 ,  H01L2924/0002 ,  H01L2924/351 ,  H01L2933/0066 ,  H01L2924/00

    Abstract: Methods for bonding semiconductor wafers requiring the transfer of electrical and optical signals between the bonded wafers and across the bonding interface. The methods incorporate the formation of both electrical and optical interconnect vias within the wafer bonding interface to transfer electrical and optical signals between the bonded wafers. The electrical vias are formed using multiplicity of metal posts each comprised of multiple layers of metal that are interfused across the bonding surface. The optical vias are formed using multiplicity of optical waveguides each comprised of a dielectric material that interfuses across the bonding interface and having an index of refraction that is higher than the index of refraction of the dielectric intermediary bonding layer between the bonded wafers. The electrical and optical vias are interspersed across the bonding surface between the bonded wafers to enable uniform transfer of both electrical and optical signals between the bonded wafers.

    Abstract translation: 用于接合半导体晶片的方法，其需要在接合的晶片之间并且跨接合界面传输电和光信号。 这些方法包括在晶片接合界面内形成电和光学互连通孔，以在接合的晶片之间转移电和光信号。 电气通孔使用多个金属柱形成，每个金属柱由多层金属组成，跨越接合表面。 光学通孔使用多个光波导形成，每个光波导由电介质材料构成，该电介质材料跨越接合界面并且具有高于接合晶片之间的电介质中间结合层的折射率的折射率。 电通孔和光通孔穿过接合的晶片之间的结合表面，以使得能够在结合的晶片之间均匀地传递电信号和光信号。

    Semiconductor Wafer Bonding Incorporating Electrical and Optical Interconnects
    6.
    发明申请
    Semiconductor Wafer Bonding Incorporating Electrical and Optical Interconnects 有权
    半导体晶圆接合结合电气和光学互连

    公开(公告)号：US20120288995A1

    公开(公告)日：2012-11-15

    申请号：US13463130

    申请日：2012-05-03

    Applicant: Hussein S. El-Ghoroury ,  Chih-Li Chuang ,  Kameshwar Yadavalli ,  Qian Fan

    Inventor： Hussein S. El-Ghoroury ,  Chih-Li Chuang ,  Kameshwar Yadavalli ,  Qian Fan

    IPC: H01L21/50

    CPC classification number: H01L33/0079 ,  H01L21/187 ,  H01L27/14618 ,  H01L27/14683 ,  H01L33/0066 ,  H01L33/0095 ,  H01L2924/0002 ,  H01L2924/351 ,  H01L2933/0066 ,  H01L2924/00

    Abstract: Methods for bonding semiconductor wafers requiring the transfer of electrical and optical signals between the bonded wafers and across the bonding interface. The methods incorporate the formation of both electrical and optical interconnect vias within the wafer bonding interface to transfer electrical and optical signals between the bonded wafers. The electrical vias are formed across the bonding surface using multiplicity of metal posts that are interfused across the bonding surface. The optical vias are formed across the bonding surface using multiplicity of optical waveguides each comprised of a dielectric material that interfuses across the bonding interface and having an index of refraction that is higher than the index of refraction of the dielectric intermediary bonding layer between the bonded wafers. The electrical and optical vias are interspersed across the bonding surface between the bonded wafers to enable uniform transfer of both electrical and optical signals between the bonded wafers.

    Abstract translation: 用于接合半导体晶片的方法，其需要在接合的晶片之间并且跨接合界面传输电和光信号。 这些方法包括在晶片接合界面内形成电和光学互连通孔，以在接合的晶片之间转移电和光信号。 电穿孔通过多个金属柱形成在结合表面上，多个金属柱跨接在结合表面上。 通过使用多个光波导形成光通孔，每个光波导由电介质材料构成，该电介质材料在接合界面之间相互连接并且具有高于接合晶片之间的电介质中间结合层的折射率的折射率 。 电通孔和光通孔穿过接合的晶片之间的结合表面，以使得能够在结合的晶片之间均匀地传递电信号和光信号。

    Display illumination system
    7.
    发明授权
    Display illumination system 有权
    显示照明系统

    公开(公告)号：US06404557B2

    公开(公告)日：2002-06-11

    申请号：US09733774

    申请日：2000-12-08

    Applicant: Michael J. Curley ,  Chih-Li Chuang ,  Zheng-Wu Li ,  Gregory J. Kintz

    Inventor： Michael J. Curley ,  Chih-Li Chuang ,  Zheng-Wu Li ,  Gregory J. Kintz

    IPC: G02B2714

    CPC classification number: G02B17/04 ,  G02B5/30

    Abstract: A virtual image display system is provided which comprises a non-emissive, reflective microdisplay which forms a source object; an optical system which forms a magnified, virtual image of the source object from light reflected off the microdisplay; a light source system which produces light to illuminate the display system; and an illumination system which forms at least two virtual light sources to illuminate the display system.

    Abstract translation: 提供虚拟图像显示系统，其包括形成源对象的非发射型反射型微型显示器; 光学系统，其从微显示器反射的光形成源物体的放大虚拟图像; 产生光以照亮显示系统的光源系统; 以及形成至少两个虚拟光源以照亮显示系统的照明系统。

    System and method for producing an enhanced image
    8.
    发明授权
    System and method for producing an enhanced image 失效
    用于产生增强图像的系统和方法

    公开(公告)号：US6052214A

    公开(公告)日：2000-04-18

    申请号：US12889

    申请日：1998-01-23

    Applicant: Chih-Li Chuang ,  David W. Kappel

    Inventor： Chih-Li Chuang ,  David W. Kappel

    IPC: G02F1/23 ,  H04N9/31 ,  G02F1/03 ,  G02B5/30 ,  G02B27/28

    CPC classification number: H04N9/3105 ,  G02F1/23

    Abstract: An imaging system and method directs white light to a reflecting polarizing surface at an angle of incidence substantially equal to the Brewster angle to help maximize or greatly increase the reflected S polarized light and minimize or greatly decrease the reflected P polarized light. A contrast enhancing device also helps to reduce the reflected P polarized light. Color splitter and combining optics devices separate the reflected polarized light into a plurality of different color light components. Light modulating devices modulate each one of the color light components and rotate selectively the S polarized light and direct P polarized light toward a viewing surface. Thus, the output transmitted contrast ratio of the transmittal P polarized light to the transmitted S polarized light is enhanced.

    Abstract translation: 成像系统和方法将白光以基本上等于布鲁斯特角的入射角将白光引导到反射偏振表面，以帮助最大化或大大增加反射的S偏振光并最小化或大大降低反射的P偏振光。 对比度增强装置还有助于减少反射的P偏振光。 分色器和组合光学器件将反射的偏振光分离成多个不同的颜色光分量。 光调制装置调制每个颜色光分量，并选择性地旋转S偏振光并将P偏振光引向观察表面。 因此，透射P偏振光与透射S偏振光的输出透射对比度增强。

    Using optical fiber multiplexer to combine light beams in a laser printer
    9.
    发明授权
    Using optical fiber multiplexer to combine light beams in a laser printer 失效
    使用光纤多路复用器将光束组合在激光打印机中

    公开(公告)号：US5666447A

    公开(公告)日：1997-09-09

    申请号：US342958

    申请日：1994-11-21

    Applicant: Chih-Li Chuang ,  Sanwal Prasad Sarraf

    Inventor： Chih-Li Chuang ,  Sanwal Prasad Sarraf

    IPC: B41J2/47 ,  G02B6/34 ,  G02B6/42 ,  H04N1/50 ,  G02B6/26

    CPC classification number: H04N1/506 ,  B41J2/473 ,  G02B6/4249

    Abstract: A color laser printing apparatus that incorporates the use of fiber optics and a flexible beam-combining device to combine two or more lasers having different wavelengths that correspond to the photosensitivities of the image-receiving media. Use of fiber optics on a flexible beam-combining device allows high flexibility in the placement of components associated with a color laser printing apparatus and making the system easier to align. Because the components of the system no longer require placement in close proximity to one another, certain aspects of the system can be made more compact and any adverse effects of heat generation of the components, such as the lasers, can be greatly reduced.

    Abstract translation: 一种结合使用光纤的彩色激光打印装置和灵活的光束组合装置，以组合具有与图像接收介质的光敏度对应的不同波长的两个或多个激光。 在柔性光束组合装置上使用光纤可以在与彩色激光打印装置相关联的部件放置方面具有高度的灵活性，并使系统更容易对准。 因为系统的组件不再需要彼此靠近放置，所以系统的某些方面可以变得更紧凑，并且可以大大减少诸如激光器的部件的发热的任何不利影响。

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