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    CONDUCTIVE PASTE COMPOSITION FOR TERMINATION ELECTRODE, MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME AND METHOD OF MANUFACTURING THEREOF
    2.
    发明申请
    CONDUCTIVE PASTE COMPOSITION FOR TERMINATION ELECTRODE, MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME AND METHOD OF MANUFACTURING THEREOF 审中-公开
    用于终止电极的导电性组合物，包括其的多层陶瓷电容器及其制造方法

    公开(公告)号：US20120154977A1

    公开(公告)日：2012-06-21

    申请号：US13111319

    申请日：2011-05-19

    申请人： Kang Heon HUR ,  Chang Hoon KIM ,  Sung Bum SOHN ,  Ji Sook KIM ,  Hyun Hee GU ,  Gun Jung YOON ,  Kyu Ha LEE ,  Sang Hoon KWON ,  Myung Jun PARK

    发明人： Kang Heon HUR ,  Chang Hoon KIM ,  Sung Bum SOHN ,  Ji Sook KIM ,  Hyun Hee GU ,  Gun Jung YOON ,  Kyu Ha LEE ,  Sang Hoon KWON ,  Myung Jun PARK

    IPC分类号： H01G4/008 ,  B32B38/10 ,  B32B37/06 ,  B32B37/14 ,  H01B1/16 ,  B32B37/02

    CPC分类号： H01G4/2325 ,  H01B1/16 ,  H01G4/30

    摘要： There are provided a conductive paste composition for a termination electrode, a multilayer ceramic capacitor having the same, and a method thereof. The conductive paste composition for a termination electrode includes a conductive metal powder and a glass frit represented by the following Formula: aSiO2-bB2O3-cAl2O3-dTMxOy-eR12O-fR2O, where TM is a transition metal selected from a group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe) and nickel (Ni); R1 is selected from a group consisting of lithium (Li), sodium (Na) and potassium (K); R2 is selected from a group consisting of magnesium (Mg), calcium (Ca), strontium (Sr) and barium (Ba); each of x and y is larger than 0; and ‘a’ ranges from 15 to 70 mol %, ‘b’ ranges from 15 to 45 mol %, ‘c’ ranges from 1 to 10 mol %, ‘d’ ranges from 1 to 50 mol %, ‘e’ ranges from 2 to 30 mol % and ‘f’ ranges from 5 to 40 mol %. The conductive paste composition for a termination electrode includes a glass frit compound having improved corrosion resistance to a plating solution, thus effectively preventing the penetration of the plating solution and enhancing chip reliability.

    摘要翻译： 提供了一种终端电极用导电性糊剂组合物及其制造方法。 用于终端电极的导电糊组合物包括导电金属粉末和由下式表示的玻璃料：aSiO 2 -BB 2 O 3 -cAl 2 O 3-d TM x O y e e 12 O-f R 2 O，其中TM是选自锌（Zn ），钛（Ti），铜（Cu），钒（V），锰（Mn），铁（Fe）和镍（Ni） R1选自锂（Li），钠（Na）和钾（K）组成的组中; R2选自镁（Mg），钙（Ca），锶（Sr）和钡（Ba）组成的组中; x和y各自大于0; 'a'为15〜70摩尔％，'b'为15〜45摩尔％，'c'为1〜10摩尔％，'d'为1〜50摩尔％，'e' 2〜30摩尔％，'f'为5〜40摩尔％。 用于端接电极的导电糊剂组合物包括具有改善的对电镀溶液的耐腐蚀性的玻璃料化合物，从而有效地防止了电镀液的渗透并提高了芯片的可靠性。