METHOD OF FILLING AN OPENING AND METHOD OF MANUFACTURING A PHASE-CHANGE MEMORY DEVICE USING THE SAME
    2.
    发明申请
    METHOD OF FILLING AN OPENING AND METHOD OF MANUFACTURING A PHASE-CHANGE MEMORY DEVICE USING THE SAME 审中-公开
    填充打开的方法和使用该方法制造相变存储器件的方法

    公开(公告)号:US20150325787A1

    公开(公告)日:2015-11-12

    申请号:US14599848

    申请日:2015-01-19

    Abstract: Example methods of filling an opening and of manufacturing a phase change memory device are disclosed. In an example method, an insulation layer having an opening is formed on a substrate. A material layer is formed on the insulation layer. The material layer fills the opening, and has a void. A first laser beam is irradiated onto the material layer, thereby removing the void or reducing a size of the void. The first laser beam is generated from a solid state laser medium.

    Abstract translation: 公开了填充开口和制造相变存储器件的示例性方法。 在示例性方法中,在基板上形成具有开口的绝缘层。 在绝缘层上形成材料层。 材料层填充开口,并具有空隙。 将第一激光束照射到材料层上,从而去除空隙或减小空隙的尺寸。 第一激光束由固态激光介质产生。

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