SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD
    10.
    发明申请
    SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD 审中-公开
    半导体衬底制造方法

    公开(公告)号:US20170009378A1

    公开(公告)日:2017-01-12

    申请号:US15114364

    申请日:2014-01-28

    摘要: A semiconductor substrate manufacturing method includes: epitaxially growing a columnar III nitride semiconductor single crystal on a principal place of a circular substrate; removing a hollow cylindrical region at an outer peripheral edge side of the III nitride semiconductor single crystal to leave a solid columnar region at an inside of the hollow cylindrical region of the III nitride semiconductor single crystal; and slicing the solid columnar region after removing the hollow cylindrical region. The hollow cylindrical region is removed such that the shape of the III nitride semiconductor single crystal is always keeps an axial symmetry that a center axis of the III nitride semiconductor single crystal is defined as a symmetric axis.

    摘要翻译: 半导体衬底制造方法包括:在圆形衬底的主要位置上外延生长柱状III族氮化物半导体单晶; 去除III族氮化物半导体单晶的外周边缘侧的中空圆柱形区域,以在III族氮化物半导体单晶的中空圆柱形区域的内侧留下实心柱状区域; 并且在去除中空圆柱形区域之后切割固体柱状区域。 去除中空的圆柱形区域,使得III族氮化物半导体单晶的形状总是保持将III族氮化物半导体单晶的中心轴定义为对称轴的轴向对称。