摘要:
In one embodiment, a data storage media comprises: a substrate comprising at least one plastic portion, an edge lift height of less than about 8μ, and an axial displacement peak of less than about 500μ under shock or vibration excitation; and at least one data layer on said substrate. The data layer can be at least partly read from, written to, or a combination thereof by at least one energy field, and, when the energy field contacts the storage media, the energy field is incident upon the data layer before it could be incident upon the substrate. In another embodiment, the data storage media comprises: a substrate comprising at least one plastic portion and an axial displacement peak of less than about 500μ under shock or vibration excitation, and an areal density of about 10 Gbit/in2; and at least one data layer on the substrate. The data layer can be at least partly read from, written to, or a combination thereof by at least one energy field, and, when the energy field contacts the storage media, the energy field is incident upon the data layer before it could be incident upon the substrate.
摘要:
Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.
摘要:
In one embodiment, the data storage media can comprise: a substrate, a data layer, and a reflective layer disposed between the data layer and the substrate. The substrate can comprise a substrate material selected from the group consisting of polyphenylene ether, blends comprising polyphenylene ether, copolymers comprising polyphenylene ether, mixtures comprising polyphenylene ether, reaction products of a compostion comprising polyphenylene ether, and composites comprising polyphenylene ether. The data layer can comprise a material selected from the group consisting of organic dye and inorganic phase change materials. The storage media can comprise imprinted features. In another embodiment, the first surface data storage media can comprise: a substrate, a reflective layer on a first side of the substrate, and a protective layer disposed on a side of the substrate opposite the first side. The protective layer can comprise silicon dioxide. The first surface data storage media comprises imprinted features.
摘要:
Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.