公开(公告)号：US06540945B2

公开(公告)日：2003-04-01

申请号：US09794174

申请日：2001-02-27

申请人： Kazunao Kubotera ,  Nirajkumar Patel

发明人： Kazunao Kubotera ,  Nirajkumar Patel

IPC分类号： H01B124

CPC分类号： B29C70/882 ,  H01B1/24

摘要： Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.

摘要翻译： 在给定水平的碳纤维上具有改善的电性能的碳纤维填充的热塑性树脂组合物由与粘合剂结合成束的热塑性树脂和碳纤维形成。 选择热塑性树脂和粘合剂是不相容的，使得纤维对树脂的粘附性差。 示例性组合物由选自聚苯乙烯，高抗冲聚苯乙烯，聚碳酸酯，聚对苯二甲酸丁二醇酯，聚对苯二甲酸乙二醇酯，聚苯醚，聚醚酰亚胺及其共混物的热塑性聚合物形成; 和与聚酰胺三元共聚物粘合剂结合成束的碳纤维。 束分散在热塑性聚合物内。 该组合物可以用于制品的注射成型，用作需要静电消散和/或EMI屏蔽的应用中的组分。 这些物品包括电子设备，灰尘处理设备和笔记本电脑外壳。

公开(公告)号：US06248262B1

公开(公告)日：2001-06-19

申请号：US09497400

申请日：2000-02-03

申请人： Kazunao Kubotera ,  Nirajkumar Patel

发明人： Kazunao Kubotera ,  Nirajkumar Patel

IPC分类号： H01B124

CPC分类号： B29C70/882 ,  H01B1/24

摘要： Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.

公开(公告)号：US07087290B2

公开(公告)日：2006-08-08

申请号：US09845743

申请日：2001-05-01

申请人： Thomas P. Feist ,  Wit C. Bushko ,  Kevin H. Dal ,  Daniel Furlano ,  Ramesh Hariharan ,  Kazunao Kubotera ,  Bernard P. Landa ,  Suresh Subramanian ,  Joseph T. Woods

发明人： Thomas P. Feist ,  Wit C. Bushko ,  Kevin H. Dal ,  Daniel Furlano ,  Ramesh Hariharan ,  Kazunao Kubotera ,  Bernard P. Landa ,  Suresh Subramanian ,  Joseph T. Woods

IPC分类号： G11B5/73 ,  G11B5/82

CPC分类号： B82Y30/00 ,  B29C43/021 ,  B29C2043/025 ,  B29D17/005 ,  B29L2017/005 ,  B82Y10/00 ,  G11B5/72 ,  G11B5/73 ,  G11B5/7315 ,  G11B5/84 ,  G11B5/8404 ,  G11B5/855 ,  G11B7/24038 ,  G11B7/24047 ,  G11B7/24056 ,  G11B7/253 ,  G11B7/2531 ,  G11B7/2532 ,  G11B7/2533 ,  G11B7/2534 ,  G11B7/2536 ,  G11B7/2542 ,  G11B7/2548 ,  G11B7/2578 ,  G11B7/258 ,  G11B7/259 ,  G11B7/26 ,  G11B7/263 ,  G11B11/10582 ,  G11B11/10584 ,  G11B11/10586 ,  G11B2007/25708 ,  G11B2007/25713 ,  G11C13/02 ,  G11C13/025 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/4903 ,  Y10T29/49043 ,  Y10T29/49069 ,  Y10T29/49158 ,  Y10T29/49172 ,  Y10T29/49176 ,  Y10T156/1002 ,  Y10T428/24355 ,  Y10T428/24479 ,  Y10T428/24967 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/31 ,  Y10T428/3154

摘要： In one embodiment, a data storage media comprises: a substrate comprising at least one plastic portion, an edge lift height of less than about 8μ, and an axial displacement peak of less than about 500μ under shock or vibration excitation; and at least one data layer on said substrate. The data layer can be at least partly read from, written to, or a combination thereof by at least one energy field, and, when the energy field contacts the storage media, the energy field is incident upon the data layer before it could be incident upon the substrate. In another embodiment, the data storage media comprises: a substrate comprising at least one plastic portion and an axial displacement peak of less than about 500μ under shock or vibration excitation, and an areal density of about 10 Gbit/in2; and at least one data layer on the substrate. The data layer can be at least partly read from, written to, or a combination thereof by at least one energy field, and, when the energy field contacts the storage media, the energy field is incident upon the data layer before it could be incident upon the substrate.

摘要翻译： 在一个实施例中，数据存储介质包括：在冲击或振动激励下，包括至少一个塑料部分，小于约8mu的边缘提升高度以及小于约500mu的轴向位移峰值的基底; 以及所述衬底上的至少一个数据层。 数据层可以至少部分地通过至少一个能量场从其读取，写入或组合，并且当能量场接触存储介质时，能量场在其可能被入射之前入射到数据层上 在基板上。 在另一个实施例中，数据存储介质包括：衬底，其在冲击或振动激励下包括至少一个塑料部分和小于约500μm的轴向位移峰值，以及约10Gbit / in 2的面密度， SUP>; 以及衬底上的至少一个数据层。 数据层可以至少部分地通过至少一个能量场从其读取，写入或组合，并且当能量场接触存储介质时，能量场在其可能被入射之前入射到数据层上 在基板上。

公开(公告)号：US20050233151A1

公开(公告)日：2005-10-20

申请号：US11151494

申请日：2005-06-13

申请人： Thomas Feist ,  Wit Bushko ,  Kevin Dal ,  Daniel Furlano ,  Ramesh Hariharan ,  Kazunao Kubotera ,  Bernard Landa ,  Suresh Subramanian ,  Joseph Woods

发明人： Thomas Feist ,  Wit Bushko ,  Kevin Dal ,  Daniel Furlano ,  Ramesh Hariharan ,  Kazunao Kubotera ,  Bernard Landa ,  Suresh Subramanian ,  Joseph Woods

IPC分类号： G11B5/65 ,  B29C43/02 ,  B32B1/00 ,  B32B9/04 ,  B32B27/00 ,  G11B5/72 ,  G11B5/73 ,  G11B5/84 ,  G11B7/005 ,  G11B7/253 ,  G11B7/257 ,  G11B7/258 ,  G11B7/26 ,  G11B11/105 ,  G11C13/02

CPC分类号： B82Y30/00 ,  B29C43/021 ,  B29C2043/025 ,  B29D17/005 ,  B29L2017/005 ,  B82Y10/00 ,  G11B5/72 ,  G11B5/73 ,  G11B5/7315 ,  G11B5/84 ,  G11B5/8404 ,  G11B5/855 ,  G11B7/24038 ,  G11B7/24047 ,  G11B7/24056 ,  G11B7/253 ,  G11B7/2531 ,  G11B7/2532 ,  G11B7/2533 ,  G11B7/2534 ,  G11B7/2536 ,  G11B7/2542 ,  G11B7/2548 ,  G11B7/2578 ,  G11B7/258 ,  G11B7/259 ,  G11B7/26 ,  G11B7/263 ,  G11B11/10582 ,  G11B11/10584 ,  G11B11/10586 ,  G11B2007/25708 ,  G11B2007/25713 ,  G11C13/02 ,  G11C13/025 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/4903 ,  Y10T29/49043 ,  Y10T29/49069 ,  Y10T29/49158 ,  Y10T29/49172 ,  Y10T29/49176 ,  Y10T156/1002 ,  Y10T428/24355 ,  Y10T428/24479 ,  Y10T428/24967 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/31 ,  Y10T428/3154

摘要： In one embodiment, the data storage media can comprise: a substrate, a data layer, and a reflective layer disposed between the data layer and the substrate. The substrate can comprise a substrate material selected from the group consisting of polyphenylene ether, blends comprising polyphenylene ether, copolymers comprising polyphenylene ether, mixtures comprising polyphenylene ether, reaction products of a compostion comprising polyphenylene ether, and composites comprising polyphenylene ether. The data layer can comprise a material selected from the group consisting of organic dye and inorganic phase change materials. The storage media can comprise imprinted features. In another embodiment, the first surface data storage media can comprise: a substrate, a reflective layer on a first side of the substrate, and a protective layer disposed on a side of the substrate opposite the first side. The protective layer can comprise silicon dioxide. The first surface data storage media comprises imprinted features.

摘要翻译： 在一个实施例中，数据存储介质可以包括：衬底，数据层和布置在数据层和衬底之间的反射层。 基材可以包括选自聚苯醚，包含聚苯醚的共混物，包含聚苯醚的共聚物，包含聚苯醚的混合物，包含聚苯醚的组合物的反应产物和包含聚苯醚的复合材料的基材。 数据层可以包括选自有机染料和无机相变材料的材料。 存储介质可以包括压印特征。 在另一个实施例中，第一表面数据存储介质可以包括：衬底，在衬底的第一侧上的反射层，以及设置在衬底的与第一侧相对的一侧上的保护层。 保护层可以包含二氧化硅。 第一表面数据存储介质包括压印特征。