Carbon-reinforced thermoplastic resin composition and articles made from same
    2.
    发明授权
    Carbon-reinforced thermoplastic resin composition and articles made from same 有权
    碳增强热塑性树脂组合物及制成的制品

    公开(公告)号:US06540945B2

    公开(公告)日:2003-04-01

    申请号:US09794174

    申请日:2001-02-27

    IPC分类号: H01B124

    CPC分类号: B29C70/882 H01B1/24

    摘要: Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.

    摘要翻译: 在给定水平的碳纤维上具有改善的电性能的碳纤维填充的热塑性树脂组合物由与粘合剂结合成束的热塑性树脂和碳纤维形成。 选择热塑性树脂和粘合剂是不相容的,使得纤维对树脂的粘附性差。 示例性组合物由选自聚苯乙烯,高抗冲聚苯乙烯,聚碳酸酯,聚对苯二甲酸丁二醇酯,聚对苯二甲酸乙二醇酯,聚苯醚,聚醚酰亚胺及其共混物的热塑性聚合物形成; 和与聚酰胺三元共聚物粘合剂结合成束的碳纤维。 束分散在热塑性聚合物内。 该组合物可以用于制品的注射成型,用作需要静电消散和/或EMI屏蔽的应用中的组分。 这些物品包括电子设备,灰尘处理设备和笔记本电脑外壳。

    Carbon-reinforced thermoplastic resin composition and articles made from same

    公开(公告)号:US06248262B1

    公开(公告)日:2001-06-19

    申请号:US09497400

    申请日:2000-02-03

    IPC分类号: H01B124

    CPC分类号: B29C70/882 H01B1/24

    摘要: Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.