-
公开(公告)号:US20250052637A1
公开(公告)日:2025-02-13
申请号:US18718438
申请日:2023-01-20
Applicant: Molex, LLC
Inventor: Wenfeng Peng , Brian Michael Zappa , Ling-Ying Lin
Abstract: Methods and systems are disclosed for inspection of a potential source location (PSL) at an industrial facility that has physical components, such as pipes and valves, that transport one or more gaseous materials. A computing device assist in refocusing a technician equipped with a network of mobile sensors and a handheld device/wand to detect a gaseous emission at the industrial facility. The mobile sensors capture measurements on a recurring basis to assist the technician responsible for operating the handheld device/wand to identify exactly which physical component located within a PSL at the industrial facility are causing fugitive emissions. The disclosed system and method update an initial PSL by considering the recurring measurements and/or other inputs (e.g., weather data) to reduce the area of the initial PSL, thus better instructing the mechanic to identify the fugitive emission.
-
公开(公告)号:US12191592B2
公开(公告)日:2025-01-07
申请号:US18429496
申请日:2024-02-01
Applicant: Molex, LLC
Inventor: Daiki Tanaka , Naoto Sasayama
IPC: H01R12/71 , H01R13/516 , H01R13/631
Abstract: A connector body includes mating guide parts having mating recesses into which counterpart mating guide parts are inserted, the reinforcing bracket includes a body part attached to end wall parts of the mating guide parts, and a pair of left and right connection arms connected to both ends of the body part, the connection arms extending to the longitudinal center of the connector body and being attached to side wall parts of the mating guide parts, the connection arm includes a side plate part and a side wall upper cover part connected to an upper end of the side plate part, at least a part of the outside of the side plate part is covered with an outside part of the side wall part, and the side wall upper cover part is curved such that a tip faces the mating recess and covers at least a part of the upper surface of the inside part of the side wall part.
-
公开(公告)号:USD1055864S1
公开(公告)日:2024-12-31
申请号:US29886217
申请日:2023-03-06
Applicant: Molex, LLC
Designer: Michael A. Bandura , Venkatesh Sathish , Jeffrey Alan Joniak , Patrick J Killian
-
公开(公告)号:US12184002B2
公开(公告)日:2024-12-31
申请号:US17603583
申请日:2020-04-23
Applicant: Molex, LLC
Inventor: Daishi Gondo
IPC: H01R12/71 , H01R12/57 , H01R12/70 , H01R13/405 , H01R13/447 , H01R13/504 , H01R13/627 , H01R13/631 , H01R13/639 , H01R13/629
Abstract: To provide a connector that is compact and reliable and can easily be produced, in addition to achieving narrow spacing between protruding parts having a plurality of terminals mounted thereto. Such a connector is therefore provided that includes half body parts, each of which includes a connector main body and a plurality of terminals mounted to the connector main body, and a main body end part formed on each end of the connector main body with the connector main bodies of the half body parts opposite each other. The connector main body is an integrated member and includes a protruding part that extends in the longitudinal direction thereof and holds the terminals, along with an embedded part connected to each end in the longitudinal direction of the protruding part. The main body end part includes a cover part that covers at least part of the embedded part of the connector main body. The cover part is a member integrated with the embedded part.
-
公开(公告)号:US20240421527A1
公开(公告)日:2024-12-19
申请号:US18747510
申请日:2024-06-19
Applicant: Molex, LLC
Inventor: Yong Qi Zhao , Jian Chen
IPC: H01R13/506 , H01R13/405 , H01R13/6581
Abstract: A connector includes an outer housing and a wafer. The outer housing is formed with a cavity and a port communicated with the cavity, the outer housing includes a housing retain portion which is positioned in the cavity. The wafer is provided to the cavity and includes a wafer retaining portion retained to the housing retain portion, at least one of the housing retain portion and the wafer retaining portion extends along an inserting direction. Therefore, it can prevent the wafer, which corresponds to the port of the outer housing, from loosening relative to the outer housing in a vertical direction, the wafer is capable of being firmly positioned in the cavity of the outer housing as to promote the electrical connecting performance.
-
公开(公告)号:USD1053147S1
公开(公告)日:2024-12-03
申请号:US29893566
申请日:2023-05-31
Applicant: Molex, LLC
Designer: Sourabh Shrinivas Joshi , Prajwal Vadavadagi , Harsha Thyagaraj
-
公开(公告)号:US20240364056A1
公开(公告)日:2024-10-31
申请号:US18644166
申请日:2024-04-24
Applicant: MOLEX, LLC
Inventor: Che-Yuan Yang , Ya-Li Xu
IPC: H01R13/6581 , H01R13/629
CPC classification number: H01R13/6581 , H01R13/629
Abstract: A connector assembly includes a guide shielding cage and a heat sink module. The guide shielding cage includes a cage body which has an inserting passageway, and a heat sink bracket which is positioned above the inserting passageway of the cage body. The heat sink module is provided to the heat sink bracket, the heat sink module includes a heat sink, a pressure-applying spring and a restoring spring; the heat sink has a pushed portion which extends into the inserting passageway, the pressure-applying spring is provided between the top plate of the heat sink bracket and the heat sink, the heat sink and the heat sink bracket are provided therebetween with a guiding construction, the guiding construction guides the heat sink to move between a first position which is at relative front and up and a second position which is at relative rear and down. When the pluggable module inserts into the inserting passageway of the guide shielding cage, the pluggable module pushes the pushed portion of the heat sink and makes the heat sink move from the first position to the second position, at the same time, an elastic acting force of the pressure-applying spring makes a bottom portion of the heat sink downwardly contact a surface of the pluggable module with an elastic pressure. When the pluggable module is withdrawn, the restoring spring drives the heat sink to move back to the first position.
-
公开(公告)号:USD1044731S1
公开(公告)日:2024-10-01
申请号:US29886211
申请日:2023-03-06
Applicant: Molex, LLC
Designer: Michael A. Bandura , Venkatesh Sathish , Jeffrey Alan Joniak
Abstract: FIG. 1 is a front bottom perspective view of a connector showing our new design;
FIG. 2 is a front top perspective view thereof;
FIG. 3 is a rear bottom perspective view thereof;
FIG. 4 is a rear top perspective view thereof;
FIG. 5 is a front view thereof;
FIG. 6 is a rear view thereof;
FIG. 7 is a left side view thereof;
FIG. 8 is a right side view thereof;
FIG. 9 is a top view thereof; and,
FIG. 10 is a bottom view thereof.
The uneven-length broken lines immediately adjacent to the shaded areas define the bounds of the claimed design and form no part thereof. The even-length broken lines depicting the remainder of the connector form no part of the claimed design.-
公开(公告)号:US20240319438A1
公开(公告)日:2024-09-26
申请号:US18632332
申请日:2024-04-11
Applicant: Molex, LLC
Inventor: Chih-Chung Hsu , Chih-Chung Wu , Zuon-Min Chuang
CPC classification number: G02B6/12004 , G02B6/424 , G02B6/4244 , G02B6/4245 , G02B2006/12102 , G02B6/30 , G02B6/4206
Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.
-
公开(公告)号:US12100912B2
公开(公告)日:2024-09-24
申请号:US18380672
申请日:2023-10-17
Applicant: Molex, LLC
Inventor: Kirk B. Peloza , Vivek Shah , Andrew Kolak , Dan Wenzel , Matt Cox , Ayman Isaac
IPC: H01R13/6581 , H01R13/627 , H01R13/6471 , H01R13/6598
CPC classification number: H01R13/6581 , H01R13/6275 , H01R13/6471 , H01R13/6598
Abstract: A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.
-
-
-
-
-
-
-
-
-