Semiconductor Diode and Method for Producing a Semiconductor Diode
    1.
    发明申请
    Semiconductor Diode and Method for Producing a Semiconductor Diode 有权
    半导体二极管及其制造方法

    公开(公告)号:US20120319299A1

    公开(公告)日:2012-12-20

    申请号:US13580646

    申请日:2011-02-10

    IPC分类号: H01L29/861 H01L21/329

    摘要: A semiconductor diode has a first semiconductor layer (102) of a first conductivity type and a second semiconductor layer of a second conductivity type having a doping. The second semiconductor layer has a vertical electrical via region (106) which is connected to the first semiconductor layer and in which the doping is modified in such a way that the electrical via region (106) has the first conductivity type. A method for producing such a semiconductor diode is described.

    摘要翻译: 半导体二极管具有第一导电类型的第一半导体层(102)和具有掺杂的第二导电类型的第二半导体层。 第二半导体层具有连接到第一半导体层的垂直电通孔区域(106),并且其中掺杂被修改为使得电通孔区域(106)具有第一导电类型。 描述了制造这种半导体二极管的方法。

    Method of Producing a Plurality of Optoelectronic Semiconductor Chips
    3.
    发明申请
    Method of Producing a Plurality of Optoelectronic Semiconductor Chips 审中-公开
    制造多种光电半导体芯片的方法

    公开(公告)号:US20140138730A1

    公开(公告)日:2014-05-22

    申请号:US14126033

    申请日:2012-06-01

    IPC分类号: H01L33/24 H01L33/00

    摘要: A method of producing a plurality of optoelectronic semiconductor chips is provided. At least one trench is incorporated into the semiconductor body by means of at least one structuring process. The trench breaks through the active zone in a vertical direction. At least one cleaning process is performed at least on exposed locations of the semiconductor body in the region of the trench. The cleaning process includes at least one plasma cleaning process, and the plasma cleaning process at least reduces a number and/or a spatial expansion of structuring residues at exposed locations of the semiconductor body at least in the region of the trench. At least one passivation layer is applied at least to exposed locations of the semiconductor body in the region of the trench.

    摘要翻译: 提供了一种制造多个光电子半导体芯片的方法。 通过至少一个结构化工艺将至少一个沟槽结合到半导体本体中。 沟槽在垂直方向穿过活动区域。 至少在沟槽区域中至少在半导体本体的暴露位置上进行至少一次清洁处理。 清洁过程包括至少一个等离子体清洁过程,并且等离子体清洁过程至少在沟槽的区域中减少半导体本体的暴露位置处的构造残余物的数量和/或空间扩展。 至少一个钝化层至少施加到沟槽区域中的半导体本体的暴露位置。

    Semiconductor diode and method for producing a semiconductor diode
    5.
    发明授权
    Semiconductor diode and method for producing a semiconductor diode 有权
    半导体二极管及半导体二极管的制造方法

    公开(公告)号:US08772911B2

    公开(公告)日:2014-07-08

    申请号:US13580646

    申请日:2011-02-10

    IPC分类号: H01L29/06

    摘要: A semiconductor diode has a first semiconductor layer (102) of a first conductivity type and a second semiconductor layer of a second conductivity type having a doping. The second semiconductor layer has a vertical electrical via region (106) which is connected to the first semiconductor layer and in which the doping is modified in such a way that the electrical via region (106) has the first conductivity type. A method for producing such a semiconductor diode is described.

    摘要翻译: 半导体二极管具有第一导电类型的第一半导体层(102)和具有掺杂的第二导电类型的第二半导体层。 第二半导体层具有连接到第一半导体层的垂直电通孔区域(106),并且其中掺杂被修改为使得电通孔区域(106)具有第一导电类型。 描述了制造这种半导体二极管的方法。