公开(公告)号：US07291548B2

公开(公告)日：2007-11-06

申请号：US11736280

申请日：2007-04-17

申请人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen E. Lehman ,  Mitesh Patel ,  Tiffany A. Byrne ,  Edward L. Martin ,  Mohd Erwan B. Basiron ,  Wei Keat Loh ,  Sheau Hooi Lim ,  Yoong Tatt P. Chin

发明人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen E. Lehman ,  Mitesh Patel ,  Tiffany A. Byrne ,  Edward L. Martin ,  Mohd Erwan B. Basiron ,  Wei Keat Loh ,  Sheau Hooi Lim ,  Yoong Tatt P. Chin

IPC分类号： H01L21/44

CPC分类号： H05K3/3436 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/3463 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

摘要翻译： 通过在基底下表面上分配聚合物以部分地嵌入设置在下表面上的低熔点焊料凸点的条件来形成应力消除层。 应力消除层流向低熔点焊料凸块。 应力补偿轴环形成在与基板相配合的基板上，并且应力补偿套环部分嵌入低熔点焊料凸块。 还包括展示应力消除层和应力补偿套环的物品。 还包括包括低熔点焊料，应力消除层和应力补偿环的计算系统。

公开(公告)号：US07253088B2

公开(公告)日：2007-08-07

申请号：US10954999

申请日：2004-09-29

申请人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen E. Lehman ,  Mitesh Patel ,  Tiffany A. Byrne ,  Edward L. Martin ,  Mohd Erwan B. Basiron ,  Wei Keat Loh ,  Sheau Hooi Lim ,  Yoong Tatt P. Chin

发明人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen E. Lehman ,  Mitesh Patel ,  Tiffany A. Byrne ,  Edward L. Martin ,  Mohd Erwan B. Basiron ,  Wei Keat Loh ,  Sheau Hooi Lim ,  Yoong Tatt P. Chin

IPC分类号： H01L21/44

CPC分类号： H05K3/3436 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/3463 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.