公开(公告)号：US20050012498A1

公开(公告)日：2005-01-20

申请号：US10791629

申请日：2004-03-03

Applicant: Soo-Chan Lee ,  Young-Kyun Sun ,  Hyun-Ho Kim ,  Byeong-Chun Lee ,  Jun-Ho Lee ,  Jong-Cheol Lee ,  Je-Hyoung Ryu ,  Tae-Gyu Kim ,  Soon-Kyu Yim

Inventor： Soo-Chan Lee ,  Young-Kyun Sun ,  Hyun-Ho Kim ,  Byeong-Chun Lee ,  Jun-Ho Lee ,  Jong-Cheol Lee ,  Je-Hyoung Ryu ,  Tae-Gyu Kim ,  Soon-Kyu Yim

IPC: G01R31/26 ,  G01R31/28 ,  H01L21/66 ,  G01R31/02

CPC classification number: G01R31/2886 ,  G01R31/2893

Abstract: A semiconductor device test apparatus includes a main body and a stacker for stacking devices before and after a test. The stacker includes at least one user tray feeder predesignated with a function for stacking un-tested devices and at least one user tray sender predesignated with a function for stacking tested devices, the user tray functions being interchangeable during stacker operation.

Abstract translation: 半导体器件测试装置包括用于在测试之前和之后堆叠器件的主体和堆叠器。 所述堆垛机包括至少一个用户托盘进料器，所述用户托盘进料器具有用于堆叠未测试的装置的功能，并且至少一个用户托盘发送器预先具有用于堆叠测试的装置的功能，所述用户托盘功能在堆叠器操作期间是可互换的。

公开(公告)号：US07176704B2

公开(公告)日：2007-02-13

申请号：US10823546

申请日：2004-04-14

Applicant: Je-hyoung Ryu ,  Tae-gyu Kim ,  Soon-kyu Yim ,  Sung-jin Lee ,  Jun-ho Lee

Inventor： Je-hyoung Ryu ,  Tae-gyu Kim ,  Soon-kyu Yim ,  Sung-jin Lee ,  Jun-ho Lee

IPC: G01R31/02

CPC classification number: G01R1/0458

Abstract: An inspecting apparatus for semiconductor devices including: a match plate; a contact module combined with the match plate, and the match plate including a radiation unit radiating heat from the semiconductor devices to the outside, and a test unit contacting leads of the semiconductor; an insert module installed on a bottom of the contact module, and having a semiconductor device accommodator to accommodate the semiconductor device; and an auxiliary radiation member installed on a bottom of the insert module, and radiating the heat from the semiconductor device to the outside. Accordingly, the inspecting apparatus for semiconductor device according to the present invention performs testing at a constant temperature regardless of heat from the semiconductors by radiating the heat from the semiconductors immediately and efficiently, thereby producing more accurate test results. Accurate testing improves productivity and saves expense by removing faulty test results caused by identifying a qualified semiconductor as a defective semiconductor due to heat radiated from the semiconductor device.

Abstract translation: 一种用于半导体器件的检查装置，包括：匹配板; 与所述匹配板组合的接触模块，所述匹配板包括从所述半导体器件向外部辐射热的辐射单元，以及接触所述半导体的引线的测试单元; 插入模块，安装在所述触点模块的底部，并且具有用于容纳所述半导体器件的半导体器件容纳器; 以及安装在所述插入模块的底部上的辅助辐射构件，并且将来自所述半导体器件的热量散发到外部。 因此，根据本发明的半导体装置的检查装置不管来自半导体的热量是恒定的，通过立即有效地辐射来自半导体的热量进行测试，从而产生更准确的测试结果。 通过从半导体器件辐射的热量，通过识别合格的半导体作为有缺陷的半导体而导致的故障测试结果，可以提高生产率并节省成本。