公开(公告)号：US06617673B2

公开(公告)日：2003-09-09

申请号：US09953704

申请日：2001-09-11

Applicant: Joon Ki Lee ,  Woon Ky Ha

Inventor： Joon Ki Lee ,  Woon Ky Ha

IPC: H01L23495

CPC classification number: H01L23/5387 ,  G11C5/04 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/0746 ,  H05K2201/094 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A memory card includes a substrate and a resin-molded layer. The substrate includes contact pads that are on a second face thereof for communication with a card reader. Semiconductor chips are on a first face of the substrate and electrically connected to the contact pads through bonding wires and circuit wiring. The resin-molded layer is on the first face and covers the chips.

公开(公告)号：US06323064B1

公开(公告)日：2001-11-27

申请号：US09476918

申请日：2000-01-04

Applicant: Joon Ki Lee ,  Woon Ky Ha

Inventor： Joon Ki Lee ,  Woon Ky Ha

IPC: G06K19/077 ,  G11C5/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H01L21/44 ,  H01L21/48

CPC classification number: H01L23/5387 ,  G11C5/04 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/0746 ,  H05K2201/094 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A memory card includes a substrate and a resin-molded layer. The substrate includes contact pads that are on a second face thereof for communication with a card reader. Semiconductor chips are on a first face of the substrate and electrically connected to the contact pads through bonding wires and circuit wiring. The resin-molded layer is on the first face and covers the chips. The fabrication process for the memory cards begins with fabrication of a multi-substrate that includes several unit substrates. At least one semiconductor chip is provided on each unit substrate and electrically connected. A continuous resin-molded layer is then formed to extend over the unit substrates. Separating the unit substrates of the multi-substrate divides the continuous resin-molded layer into individual resin-molded units and provides the memory cards.

Abstract translation: 存储卡包括基板和树脂模制层。 衬底包括位于其第二面上的用于与读卡器通信的接触焊盘。 半导体芯片位于基板的第一面上，并通过接合线和电路布线与接触焊盘电连接。 树脂成型层在第一面上并覆盖芯片。 存储卡的制造过程开始于制造包括多个单元基板的多基板。 至少一个半导体芯片设置在每个单元基板上并电连接。 然后形成连续的树脂模制层以在单元基板上延伸。 分离多基板的单元基板将连续的树脂模制层分成单独的树脂模制单元并提供存储卡。