公开(公告)号：US08244500B2

公开(公告)日：2012-08-14

申请号：US12476559

申请日：2009-06-02

Applicant: Yun-Zong Tian ,  Chun Chi Chen ,  Yi Feng Lee ,  Wei Jun Chen ,  Shih Chang Kao ,  Yij Chieh Chu ,  Cheng-Hao Chen

Inventor： Yun-Zong Tian ,  Chun Chi Chen ,  Yi Feng Lee ,  Wei Jun Chen ,  Shih Chang Kao ,  Yij Chieh Chu ,  Cheng-Hao Chen

IPC: G06F11/30 ,  G06F19/00

CPC classification number: G05B19/41865 ,  G05B2219/32015 ,  G05B2219/32016 ,  G05B2219/32019 ,  G05B2219/45031 ,  Y02P90/20

Abstract: A method of adjusting wafer process sequence includes steps of collecting production parameters for a plurality of lots; selecting a plurality of key parameters from the production parameters, wherein the key parameters at least includes a processing sequence; defining a formula to obtain an epsilon value; categorizing the lots into groups according to the epsilon value and the minimum point number by using density-based spatial clustering of application with noise (DBSCAN); and adjusting the processing sequences of the lots in the groups. Thereby, the lots with the same process recipe can be continuously or simultaneously sent into a machine, thereby reducing replacement of process recipes or shortening machine idle time.

Abstract translation: 调整晶片工艺顺序的方法包括收集多个批次的生产参数的步骤; 从所述生产参数中选择多个关键参数，其中所述关键参数至少包括处理序列; 定义公式以获得ε值; 通过使用基于密度的噪声空间聚类（DBSCAN），根据ε值和最小点数将批次分组成组。 并调整组中批次的处理顺序。 因此，具有相同处理配方的批次可以连续或同时发送到机器中，从而减少过程配方的更换或缩短机器空闲时间。

公开(公告)号：US08195431B2

公开(公告)日：2012-06-05

申请号：US12566974

申请日：2009-09-25

Applicant: Yi Feng Lee ,  Chun Chi Chen ,  Shih Chang Kao ,  Yun-Zong Tian ,  Wei Jun Chen

Inventor： Yi Feng Lee ,  Chun Chi Chen ,  Shih Chang Kao ,  Yun-Zong Tian ,  Wei Jun Chen

IPC: G06F15/00 ,  G06F19/00

CPC classification number: G06Q10/00

Abstract: A method for evaluating efficacy of prevention maintenance for a tool includes the steps of: choosing a tool which has been maintained preventively and choosing a productive parameter of the tool; collecting values of the productive parameter generated from the tool during a time range for building a varying curve of the productive parameter versus time, modifying the varying curve with a moving average method; transforming the varying curve into a Cumulative Sum chart; and judging whether the values of the productive parameter generated from the tool after the prevention maintenance are more stable, compared with the values of the productive parameter generated from the tool before the prevention maintenance, according to the Cumulative Sum chart. Thereby, if the varying of the values of the productive parameter after the prevention maintenance isn't stable, then the efficacy of this prevention maintenance for the tool is judged not good.

Abstract translation: 一种用于评估工具的预防维护功效的方法包括以下步骤：选择已预先维护的工具并选择工具的生产参数; 在用于构建生产参数对时间的变化曲线的时间范围内收集从工具产生的生产参数的值，以移动平均法修改变化曲线; 将变化曲线转换为累计总和图; 并且根据累计总和图来判断在防止维护之后从工具生成的生产参数的值是否比预防维护之前从工具产生的生产参数的值更稳定。 因此，如果防止维护后的生产参数的值的变化不稳定，则对该工具的该防止维护的功效被判断为不好。

公开(公告)号：US08170964B2

公开(公告)日：2012-05-01

申请号：US12471711

申请日：2009-05-26

Applicant: Wei Jun Chen ,  Chun Chi Chen ,  Yun-Zong Tian ,  Yi Feng Lee ,  Tsung-Wei Lin

Inventor： Wei Jun Chen ,  Chun Chi Chen ,  Yun-Zong Tian ,  Yi Feng Lee ,  Tsung-Wei Lin

IPC: G07B15/00

CPC classification number: G06N3/126 ,  G06N7/02

Abstract: A method for planning a semiconductor manufacturing process based on users' demands includes the steps of: establishing a genetic algorithm model and inputting data; establishing a fuzzy system and setting one output parameter representing percent difference of each cost function in neighbor generations; setting to have a modulation parameter corresponding to each input parameter for adjusting fuzzy sets of the output parameter; executing genetic algorithm actions; executing fuzzy inference actions; eliminating chromosomes that produce output parameter smaller than a defined lower limit, and the remaining chromosomes that produces the largest output parameter is defined as the optimum chromosome, wherein the genetic algorithm actions stops being executed upon the optimum chromosome; then determining whether or not a defined number of generations has been reached, if yes, executing the optimum chromosome of the last generation; if no, continuing executing the genetic algorithm actions, thereby finding the optimum semiconductor manufacturing process for users.

Abstract translation: 一种基于用户需求的半导体制造过程规划方法，包括以下步骤：建立遗传算法模型并输入数据; 建立一个模糊系统，并设置一个输出参数，代表相邻代的每个成本函数的百分比差; 设置为具有对应于每个输入参数的调制参数，用于调整输出参数的模糊集合; 执行遗传算法动作; 执行模糊推理动作; 消除产生小于规定下限的输出参数的染色体，将产生最大输出参数的剩余染色体定义为最佳染色体，其中遗传算法动作停止在最佳染色体上执行; 然后确定是否已经达到定义数量的世代，如果是，则执行最后一代的最佳染色体; 如果否，继续执行遗传算法动作，从而为用户找到最佳的半导体制造过程。

公开(公告)号：US08032248B2

公开(公告)日：2011-10-04

申请号：US12507396

申请日：2009-07-22

Applicant: Yi Feng Lee ,  Chun Chi Chen ,  Yun-Zong Tian ,  Wei Jun Chen ,  Tsung-Wei Lin

Inventor： Yi Feng Lee ,  Chun Chi Chen ,  Yun-Zong Tian ,  Wei Jun Chen ,  Tsung-Wei Lin

IPC: G06F19/00 ,  G06F11/30 ,  G21C17/00 ,  H03F1/36 ,  H04B15/00

CPC classification number: G06Q10/06

Abstract: A method for finding the correlation between tool PM (prevention maintenance) and the product yield of the tool is disclosed. The method uses a moving average method to magnify a curve trend that is formed by the product yield data that is captured during a predetermined days before PM and after PM. The magnified curve trend is shown by a Cumulative sum chart. The Cumulative sum chart is analyzed for informing related workers of the effect between the tool PM and the product yield, so as to accurately estimate PM timing. Thereby, via the method, the effect between the tool PM and the product yield may be determined, which serves as an important reference for workers to execute further PM.

Abstract translation: 公开了一种用于找到工具PM（防止维护）与工具的产品收益之间的相关性的方法。 该方法使用移动平均法来放大在PM和PM之后的预定日期内捕获的产品产量数据形成的曲线趋势。 放大曲线趋势由累积和图表示。 分析累积总和图，通知相关工作者工具PM与产品产量之间的影响，以准确估计PM定时。 因此，通过该方法，可以确定工具PM和产品产量之间的效果，其作为工人进一步执行PM的重要参考。

公开(公告)号：US20110112999A1

公开(公告)日：2011-05-12

申请号：US12703999

申请日：2010-02-11

Applicant: YI-FENG LEE ,  SHIH CHANG KAO ,  YUN-ZONG TIAN ,  WEI JUN CHEN

Inventor： YI-FENG LEE ,  SHIH CHANG KAO ,  YUN-ZONG TIAN ,  WEI JUN CHEN

IPC: G06N3/10 ,  G06F15/18

CPC classification number: H01L22/20

Abstract: A method for predicting and warning of WAT value includes the steps as follows. A key process is selected and a WAT value after finishing the key process is used as a predictive goal. A predicting model is built. One batch or plural batches of predictive wafers are prepared, and a Fault Detection and Classification data (FDC data) and a metrology data from the predictive wafers of the key process are collected. The FDC data and the metrology data collected from the predictive wafers are inputted into the predicting model for processing a normal predicting procedure, and a predictive WAT value by the predicting model is outputted. The present invention can accurately predict the WAT value, effectively monitor some specific defective wafers and continuously perform the improvement for the specific defective wafer.

Abstract translation: WAT值的预测和预警方法包括以下步骤。 选择关键过程，完成关键过程后的WAT值作为预测目标。 建立了预测模型。 准备一批或多批预测晶片，并且收集来自关键过程的预测晶片的故障检测和分类数据（FDC数据）和度量数据。 从预测晶片收集的FDC数据和计量数据被输入到用于处理正常预测过程的预测模型中，并且输出由预测模型的预测WAT值。 本发明可以准确地预测WAT值，有效地监视一些特定的缺陷晶片，并且连续地对特定缺陷晶片进行改进。

公开(公告)号：US20100233830A1

公开(公告)日：2010-09-16

申请号：US12469051

申请日：2009-05-20

Applicant: YI FENG LEE ,  CHUN CHI CHEN ,  YUN-ZONG TIAN ,  WEI JUN CHEN

Inventor： YI FENG LEE ,  CHUN CHI CHEN ,  YUN-ZONG TIAN ,  WEI JUN CHEN

IPC: H01L21/66

CPC classification number: G05B19/41875 ,  G05B2219/31483 ,  G05B2219/32191 ,  G05B2219/45031 ,  H01L22/20 ,  Y02P90/22

Abstract: A method for monitoring fabrication parameters comprises steps of: obtaining a normal parameter variance curve and a comparing parameter variance curve; defining a plurality of normal parameter points on the normal parameter variance curve; defining a plurality of comparing parameter points on the comparing parameter variance curve; finding out the corresponding comparing parameter points nearest to the normal parameter points; calculating the distances between the normal parameter points and the corresponding comparing parameter points thereof; summing up the distances so as to receive a total distance; and determining whether or not the total distance exceeds a limit. Via this arrangement, when fabrication parameter of tool is abnormal, it can be efficiently and immediately determined.

Abstract translation: 一种用于监测制造参数的方法包括以下步骤：获得正常参数方差曲线和比较参数方差曲线; 在正常参数方差曲线上定义多个正常参数点; 在比较参数方差曲线上定义多个比较参数点; 找出最接近正常参数点的相应比较参数点; 计算正常参数点与其对应的比较参数点之间的距离; 总结距离，以获得总距离; 并确定总距离是否超过限制。 通过这种布置，当工具的制造参数异常时，可以有效且立即确定。

公开(公告)号：US20090276182A1

公开(公告)日：2009-11-05

申请号：US12140584

申请日：2008-06-17

Applicant: YI FENG LEE ,  CHUN CHI CHEN ,  YUN-ZONG TIAN

Inventor： YI FENG LEE ,  CHUN CHI CHEN ,  YUN-ZONG TIAN

IPC: G06F17/18 ,  G06F15/00

CPC classification number: G05B19/41875 ,  G05B2219/32196 ,  G05B2219/32197 ,  G05B2219/45031 ,  Y02P90/22

Abstract: A machine fault detection method is applied to a plurality of machines. The machines are used for processing at least one wafer-in-process (WIP). The method includes the flowing steps. A statistical database of the wafer-in-process is provided. An association rules is used to search and survey the statistical database in order to calculate a support degree and a reliability degree. A threshold is selected to determine whether the support degree and the reliability degree have surpassed the threshold or not. When the support degree and the reliability degree have surpassed the threshold, a root cause error in the statistical database corresponded by the support degree and the reliability degree is determined. When the support degree and the reliability degree have not surpassed the threshold, the above steps are repeated.

Abstract translation: 机器故障检测方法应用于多台机器。 这些机器用于处理至少一个晶片在制品（WIP）。 该方法包括流动步骤。 提供了晶片在制程的统计数据库。 使用关联规则来搜索和调查统计数据库，以计算支持度和可靠度。 选择阈值来确定支持度和可靠度是否超过阈值。 当支持度和可靠度超过阈值时，统计数据库中的根本原因误差由支持度和可靠度决定。 当支撑度和可靠度没有超过阈值时，重复上述步骤。

公开(公告)号：US20090197354A1

公开(公告)日：2009-08-06

申请号：US12144488

申请日：2008-06-23

Applicant: Tzu-Cheng Lin ,  Yun-Zong Tian ,  Chun-Chi Chen ,  Yi-Feng Lee

Inventor： Tzu-Cheng Lin ,  Yun-Zong Tian ,  Chun-Chi Chen ,  Yi-Feng Lee

IPC: H01L21/66 ,  G06T11/20

CPC classification number: G05B19/41875 ,  G05B2219/32196 ,  G05B2219/45031 ,  Y02P90/22

Abstract: A system and method for monitoring a manufacturing process are provided. A wafer is provided. Process parameters of a manufacturing machine are in-situ measured and recorded if the wafer is processed in the manufacturing machine. A wafer measured value of the wafer is measured after the wafer has been processed. The process parameters are transformed into a process summary value. A two dimensional orthogonal chart with a first axis representing the wafer measured value and a second axis representing the process summary value is provided. The two dimensional orthogonal chart includes a close-loop control limit. A visualized point representing the wafer measured value and the process summary value is displayed on the two dimensional orthogonal chart.

Abstract translation: 提供了一种用于监视制造过程的系统和方法。 提供晶片。 如果在制造机器中处理晶片，则原位测量和记录制造机器的工艺参数。 在晶片处理后测量晶片的晶圆测量值。 过程参数被转换为过程摘要值。 提供具有表示晶片测量值的第一轴的二维正交图和表示处理总结值的第二轴。 二维正交图包括闭环控制极限。 表示晶圆测量值和过程总结值的可视化点显示在二维正交图上。

公开(公告)号：US20110251708A1

公开(公告)日：2011-10-13

申请号：US12783510

申请日：2010-05-19

Applicant: Wei-Jun Chen ,  Yun-Zong Tian ,  Yij-Chieh Chu ,  Yi-Feng Lee

Inventor： Wei-Jun Chen ,  Yun-Zong Tian ,  Yij-Chieh Chu ,  Yi-Feng Lee

IPC: G06F19/00

CPC classification number: G06Q10/06 ,  Y02P90/86

Abstract: A method for planning a production schedule of equipment includes: receiving information about a material replacement of the equipment; and determining a target production schedule of the equipment according to the information about the material replacement of the equipment, wherein the target production schedule includes an idle period, and during the idle period, the equipment stops manufacturing under a normal state.

Abstract translation: 一种用于规划设备生产计划的方法包括：接收关于设备的材料更换的信息; 根据关于设备的材料更换的信息来确定设备的目标生产进度，其中目标生产计划包括空闲时段，并且在空闲期间，设备在正常状态下停止制造。

公开(公告)号：US20110010132A1

公开(公告)日：2011-01-13

申请号：US12566974

申请日：2009-09-25

Applicant: YI-FENG LEE ,  CHUN-CHI CHEN ,  SHIH-CHANG KAO ,  YUN-ZONG TIAN ,  WEI-JUN CHEN

Inventor： YI-FENG LEE ,  CHUN-CHI CHEN ,  SHIH-CHANG KAO ,  YUN-ZONG TIAN ,  WEI-JUN CHEN

IPC: G06F15/00

CPC classification number: G06Q10/00

Abstract: A method for evaluating efficacy of prevention maintenance for a tool includes the steps of: choosing a tool which has been maintained preventively and choosing a productive parameter of the tool; collecting values of the productive parameter generated from the tool during a time range for building a varying curve of the productive parameter versus time, modifying the varying curve with a moving average method; transforming the varying curve into a Cumulative Sum chart; and judging whether the values of the productive parameter generated from the tool after the prevention maintenance are more stable, compared with the values of the productive parameter generated from the tool before the prevention maintenance, according to the Cumulative Sum chart. Thereby, if the varying of the values of the productive parameter after the prevention maintenance isn't stable, then the efficacy of this prevention maintenance for the tool is judged not good.

Abstract translation: 一种用于评估工具的预防维护功效的方法包括以下步骤：选择已预先维护的工具并选择工具的生产参数; 在用于构建生产参数对时间的变化曲线的时间范围内收集从工具产生的生产参数的值，以移动平均法修改变化曲线; 将变化曲线转换为累计总和图; 并且根据累计总和图来判断在防止维护之后从工具生成的生产参数的值是否比预防维护之前从工具产生的生产参数的值更稳定。 因此，如果防止维护后的生产参数的值的变化不稳定，则对该工具的该防止维护的功效被判断为不好。