公开(公告)号：US06729532B2

公开(公告)日：2004-05-04

申请号：US10037125

申请日：2001-10-25

申请人： Masafumi Inoue ,  Yusuke Yamamoto ,  Hikaru Onizaki ,  Yoichi Yanai ,  Yasuhiro Morimitsu

发明人： Masafumi Inoue ,  Yusuke Yamamoto ,  Hikaru Onizaki ,  Yoichi Yanai ,  Yasuhiro Morimitsu

IPC分类号： B23K3512

CPC分类号： H05K3/3442 ,  H05K3/3484 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2203/048 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49179

摘要： A component mounting method for mounting several micro component chips aligned in parallel onto a board by soldering. An allowable offset is set for each electrode, taking into account a self-alignment effect of melted solder in soldering for bonding component terminals onto electrodes formed on the board corresponding to a component layout. Solder printing and component placement onto the electrodes are shifted by the offset. This offset is balanced by the self-alignment effect of melted solder, and each component is secured at an appropriate position. This mounting method allows less stringent spacing conditions to be applied for mounting and prevents the occurrence of defects during printing and placement.

摘要翻译： 一种用于通过焊接将几个微型组件芯片并联平行地安装到板上的部件安装方法。 考虑到焊接中熔化的焊料的自对准效应，将组件端子接合到对应于部件布局的板上形成的电极上，为每个电极设置允许的偏移。 焊接印刷和部件放置在电极上移位偏移。 该偏移由熔融焊料的自对准效应平衡，并且每个部件固定在适当的位置。 该安装方法允许不太严格的间隔条件用于安装，并防止在打印和放置期间出现缺陷。