-
公开(公告)号：US06729532B2
公开(公告)日：2004-05-04
申请号：US10037125
申请日：2001-10-25
IPC分类号： B23K3512
CPC分类号： H05K3/3442 , H05K3/3484 , H05K2201/10522 , H05K2201/10636 , H05K2203/048 , H05K2203/0545 , Y02P70/611 , Y02P70/613 , Y10T29/49144 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49169 , Y10T29/49179
摘要： A component mounting method for mounting several micro component chips aligned in parallel onto a board by soldering. An allowable offset is set for each electrode, taking into account a self-alignment effect of melted solder in soldering for bonding component terminals onto electrodes formed on the board corresponding to a component layout. Solder printing and component placement onto the electrodes are shifted by the offset. This offset is balanced by the self-alignment effect of melted solder, and each component is secured at an appropriate position. This mounting method allows less stringent spacing conditions to be applied for mounting and prevents the occurrence of defects during printing and placement.
摘要翻译： 一种用于通过焊接将几个微型组件芯片并联平行地安装到板上的部件安装方法。 考虑到焊接中熔化的焊料的自对准效应，将组件端子接合到对应于部件布局的板上形成的电极上，为每个电极设置允许的偏移。 焊接印刷和部件放置在电极上移位偏移。 该偏移由熔融焊料的自对准效应平衡，并且每个部件固定在适当的位置。 该安装方法允许不太严格的间隔条件用于安装，并防止在打印和放置期间出现缺陷。
-
公开(公告)号：US07213332B2
公开(公告)日：2007-05-08
申请号：US10922731
申请日：2004-08-20
IPC分类号： H05K3/34
CPC分类号： H05K13/08 , H05K13/0469 , Y10T29/49004 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178
摘要： A method of mounting a component on electrodes on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solders for the component is situated on the electrodes. The printing positions of the solders are stored. Mounting position data for where the component is to be mounted on the solders is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.
摘要翻译： 将组件安装在电路板上的方法。 计算安装组件的安装坐标。 确定组件的焊料位于电极上的打印位置。 存储焊料的打印位置。 基于以前的步骤制备安装在焊料上的部件的安装位置数据。 使用前面步骤中收集的信息安装组件。
-
公开(公告)号：US20050015975A1
公开(公告)日：2005-01-27
申请号：US10922731
申请日：2004-08-20
CPC分类号： H05K13/08 , H05K13/0469 , Y10T29/49004 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178
摘要： A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the component is situation on the electrode. The printing positions of the solder are stored. Mounting position data for where the component is to be mounted on the solder is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.
摘要翻译： 将组件安装在电路板上的方法。 计算安装组件的安装坐标。 确定组件焊料在电极上的打印位置。 存储焊料的印刷位置。 基于前面的步骤准备将组件安装在焊料上的安装位置数据。 使用前面步骤中收集的信息安装组件。
-
公开(公告)号：US06983538B2
公开(公告)日：2006-01-10
申请号：US10696598
申请日：2003-10-29
CPC分类号： H05K13/08 , H05K13/0469 , Y10T29/49004 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178
摘要： A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the component is situation on the electrode. The printing positions of the solder are stored. Mounting position data for where the component is to be mounted on the solder is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.
摘要翻译： 将组件安装在电路板上的方法。 计算安装组件的安装坐标。 确定组件焊料在电极上的打印位置。 存储焊料的印刷位置。 基于前面的步骤准备将组件安装在焊料上的安装位置数据。 使用前面步骤中收集的信息安装组件。
-
公开(公告)号：US20130000359A1
公开(公告)日：2013-01-03
申请号：US13635204
申请日：2011-03-23
IPC分类号： C03B7/10
CPC分类号： C03B7/005 , C03B7/10 , G05B19/18 , G05B19/402 , G05B2219/45009
摘要： Gob producing device with a molten glass feeder having an orifice at its bottom portion and a cutter for cutting the molten glass pushed out through the orifice so as to be suspended and produce a gob. The gob producing device includes a cutter position moving for adjusting the height of the cutter mechanism by moving it, a gob observing device for observing the falling gob in three dimensions, an image processor for obtaining the gob length from spatial position data obtained by the gob observing device to determine acceptance or rejection of the length and calculating correction data for correcting the cutter's height from the difference between measured and set values of the gob length when the obtained length is determined to be inappropriate, and a control device for moving the cutter mechanism by controlling the cutter position moving mechanism's operation on the basis of the correction data.
摘要翻译： 具有在其底部具有孔口的熔融玻璃进料器的Gob生产装置和用于切割通过孔推出的熔融玻璃以便悬浮并产生料滴的切割器。 料滴产生装置包括用于通过移动来调节切割机构的高度的切割器位置，用于观察三维下落的料滴的料滴观察装置，用于从料滴获得的空间位置数据获得料滴长度的图像处理器 观察装置，以确定所述长度的接受或拒绝，并且当所述长度被确定为不合适时，计算用于校正所述切割器高度的校正数据与所述料粒长度的测量值和设定值之间的差;以及控制装置，用于使所述切割机构 通过基于校正数据控制切割器位置移动机构的操作。
-
-
-
-
搜索结果
5 条记录 (耗时 0.025 秒)