公开(公告)号：US5450289A

公开(公告)日：1995-09-12

申请号：US206179

申请日：1994-03-07

Applicant: Yooung D. Kweon ,  Min C. An

Inventor： Yooung D. Kweon ,  Min C. An

IPC: H01L23/495 ,  H05K1/18 ,  H05K3/34 ,  H01R9/00 ,  H05K7/02

CPC classification number: H01L23/49555 ,  H05K1/183 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K2201/09036 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y02P70/613

Abstract: An arrangement for vertically mounting a semiconductor device to a substrate, e.g., a printed circuit board (PCB), in which a plurality of sequentially arranged external leads of the semiconductor device include at least three different sets of non-consecutive ones of the external leads which have laterally outwardly extending foot portions lying in respective, vertically spaced-apart planes, and in which the foot portions of first and second ones of the sets of non-consecutive external leads are respectively secured to respective first and second steps formed in one of a plurality of walls defining a cavity in the PCB, and a third set of the non-consecutive external leads are secured to a portion of a major surface of the PCB adjacent the cavity.

Abstract translation: 用于将半导体器件垂直安装到衬底（例如印刷电路板（PCB））的布置，其中半导体器件的多个顺序排列的外部引线包括至少三个不同的一组不连续的外部引线 其具有位于相应的，垂直间隔开的平面中的横向向外延伸的脚部分，并且其中第一和第二组非连续外部引线的脚部分别固定到相应的第一和第二台阶， 在PCB中限定空腔的多个壁，以及第三组非连续外部引线固定到邻近空腔的PCB的主表面的一部分。