公开(公告)号：US07569418B2

公开(公告)日：2009-08-04

申请号：US11219214

申请日：2005-09-01

Applicant: Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

Inventor： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC: H01L21/00

CPC classification number: H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A method for securing a semiconductor device to a carrier substrate includes inserting a semiconductor device with a plurality of stub contacts extending from a bottom edge thereof into a receptacle of an alignment device associated with the carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, the semiconductor device is biased so as to establish and maintain electrical communication between the semiconductor device and the carrier substrate.

Abstract translation: 一种用于将半导体器件固定到载体衬底的方法包括：将半导体器件从其底部边缘延伸到与载体衬底相关联的对准器件的插座中插入多个短截线。 在将对准装置附接到载体基板并将可垂直安装的半导体装置插入到插座中时，半导体器件被偏置以便建立并维持半导体器件和载体衬底之间的电连通。

公开(公告)号：US07494920B2

公开(公告)日：2009-02-24

申请号：US11250687

申请日：2005-10-14

Applicant: Daniel McCarthy ,  Lakshman Withanawasam

Inventor： Daniel McCarthy ,  Lakshman Withanawasam

IPC: H01L21/4763

CPC classification number: H01L23/3121 ,  H01L21/4846 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/48247 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1064 ,  H05K3/3442 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y02P70/613

Abstract: A method of fabricating a vertically mountable integrated circuit (IC) package is presented. An integrated circuit is mounted on a printed circuit board (PCB) and electrically coupled to a bond pad on the PCB. The bond pad is coupled with a via that is embedded in the PCB. The IC, the bond pad, the via, and a portion of the PCB are singulated in order to create a vertically mountable IC package. The via is cut through cross-sectionally during singulation so as to expose a portion of the via and thereby provide a mountable area for the IC package. The IC package may be encapsulated or housed in a dielectric material. In addition, the via may be treated with a preservative or other s-uitable electroless metal plating deposition that prevents oxidation and promotes solderability.

Abstract translation: 提出了制造可垂直安装的集成电路（IC）封装的方法。 集成电路安装在印刷电路板（PCB）上并电耦合到PCB上的接合焊盘。 接合焊盘与嵌入在PCB中的通孔耦合。 将IC，接合焊盘，通孔和PCB的一部分分开以形成可垂直安装的IC封装。 在分割期间通孔横截面切割，以便露出通孔的一部分，从而为IC封装提供可安装区域。 IC封装可以封装或容纳在电介质材料中。 此外，可以用防腐剂或其它可防止氧化并促进可焊性的适用的无电金属电镀沉积来处理通孔。

公开(公告)号：US07084351B2

公开(公告)日：2006-08-01

申请号：US10237645

申请日：2002-09-09

Applicant: Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

Inventor： Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

IPC: H05K1/18

CPC classification number: H05K3/4007 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/321 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10696 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate.

公开(公告)号：US06853542B2

公开(公告)日：2005-02-08

申请号：US10256742

申请日：2002-09-27

Applicant: Michinori Sasaki

Inventor： Michinori Sasaki

IPC: H04N5/64 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  G06F1/16

CPC classification number: H05K1/116 ,  H04N5/64 ,  H05K1/0295 ,  H05K3/3447 ,  H05K2201/09954 ,  H05K2201/10696

Abstract: A video-apparatus-tuner mounting board includes a television tuner mounted on the board; a predetermined circuit to be connected to pins connected to an internal circuit of the television tuner; through holes arranged in a line, into which pins are inserted; and conductor lands, formed around the through holes, to be connected to the pins. Of the conductor lands, first conductor lands connected to the pins of a specific television tuner to be mounted on the board are connected to the predetermined circuit and to second conductor lands, which are not connected to the pins of the specific television tuner.

Abstract translation: 视频装置调谐器安装板包括安装在电路板上的电视调谐器; 要连接到连接到电视调谐器的内部电路的引脚的预定电路; 一排排成一排的通孔，销插入其中; 并且形成在通孔周围的导体平台连接到销。 在导体焊盘中，连接到要安装在板上的特定电视调谐器的引脚的第一导体焊盘连接到预定电路和未连接到特定电视调谐器的引脚的第二导体焊盘。

公开(公告)号：US20030076665A1

公开(公告)日：2003-04-24

申请号：US10301990

申请日：2002-11-22

Inventor： Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

IPC: H05K007/02 ,  H05K007/06 ,  H05K007/08 ,  H05K007/10

CPC classification number: H05K3/4007 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/321 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10696 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate.

Abstract translation: 一种装置，包括电路，具有连接到所述电路并具有第二端的第一端的引线和连接到所述引线的第二端的可变形结构。 本发明可以实现在电路板上，使得电路板包括基板和连接到所述基板的可变形结构。

公开(公告)号：US06535393B2

公开(公告)日：2003-03-18

申请号：US09205796

申请日：1998-12-04

Applicant: Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

Inventor： Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

IPC: H05K114

CPC classification number: H05K3/4007 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/321 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10696 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate. Also disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.

Abstract translation: 一种装置，包括电路，具有连接到所述电路并具有第二端的第一端的引线和连接到所述引线的第二端的可变形结构。 本发明可以实现在电路板上，使得电路板包括基板和连接到所述基板的可变形结构。 还公开了一种包括具有有源侧和非有源侧的电路的装置，封装电路的有源侧的封装件，并且不包围电路的非有源侧的一部分，以及具有第一端 通过芯片上引线连接到电路的有源侧，并具有从封装延伸的第二端。 还公开了一种包括由柔性导体形成的电路和引线的器件，其中引线具有连接到电路的第一端。

公开(公告)号：US20030031000A1

公开(公告)日：2003-02-13

申请号：US10237579

申请日：2002-09-09

Inventor： Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

IPC: H05K007/02 ,  H05K007/06 ,  H05K007/08 ,  H05K007/10

CPC classification number: H05K3/4007 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/321 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10696 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.

Abstract translation: 公开了一种包括具有有源侧和非有源侧的电路的器件，封装电路的有源侧的封装，并且不包围电路的非有源侧的一部分，以及引线，其具有连接到第一端 经由引线芯片连接到电路的有源侧，并且具有从封装延伸的第二端。 还公开了一种包括由柔性导体形成的电路和引线的器件，其中引线具有连接到电路的第一端。

公开(公告)号：US20020176230A1

公开(公告)日：2002-11-28

申请号：US10191701

申请日：2002-07-08

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K007/20

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

公开(公告)号：US06330159B1

公开(公告)日：2001-12-11

申请号：US09606972

申请日：2000-06-28

Applicant: Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K720

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract translation: 一种高密度垂直表面贴装封装及其热载体，包括散热片

公开(公告)号：US6061242A

公开(公告)日：2000-05-09

申请号：US257567

申请日：1999-02-25

Applicant: David J. Corisis ,  Walter L. Moden

Inventor： David J. Corisis ,  Walter L. Moden

IPC: H01L23/495 ,  H05K3/30 ,  H05K7/20

CPC classification number: H05K3/303 ,  H01L23/49568 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613

Abstract: A semiconductor device having a die paddle and a die disposed on the die paddle. The die paddle serves as a heat dissipation device and the die paddle is partially and/or fully encapsulated by a package body. Thermal posts extend from the die paddle to direct heat from the semiconductor device to a printed circuit board and further provide stability and alignment during placement of the semiconductor device on the printed circuit board.

Abstract translation: 一种半导体器件，具有裸片和芯片上的裸片。 管芯焊盘用作散热装置，并且管芯焊盘部分地和/或完全被封装主体封装。 散热柱从模板延伸，以将热量从半导体器件引导到印刷电路板，并且在将半导体器件放置在印刷电路板上时进一步提供稳定性和对准。