公开(公告)号：US20150329740A1

公开(公告)日：2015-11-19

申请号：US14810631

申请日：2015-07-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate ,  Hiroko Akiyama ,  Naota Sugiyama ,  Brant U. Kolb ,  Eric G. Larson

IPC: C09D163/00 ,  C08K3/36 ,  H01L23/29

CPC classification number: H01L23/296 ,  C08K3/36 ,  C08K9/06 ,  C08L63/00 ,  H01L21/563 ,  H01L23/10 ,  H01L23/293 ,  H01L23/295 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.

Abstract translation: 本发明的半导体封装树脂组合物包括环氧树脂，固化剂，无机颗粒，用含有光聚合官能团的硅烷表面处理的纳米颗粒和光聚合引发剂。

公开(公告)号：US09773714B2

公开(公告)日：2017-09-26

申请号：US14810631

申请日：2015-07-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate ,  Hiroko Akiyama ,  Naota Sugiyama ,  Brant U. Kolb ,  Eric G. Larson

IPC: H01L23/29 ,  C08L63/00 ,  H01L23/10 ,  H01L21/56 ,  C08K3/36 ,  C08K9/06 ,  H01L33/56

CPC classification number: H01L23/296 ,  C08K3/36 ,  C08K9/06 ,  C08L63/00 ,  H01L21/563 ,  H01L23/10 ,  H01L23/293 ,  H01L23/295 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.

公开(公告)号：US20140217622A1

公开(公告)日：2014-08-07

申请号：US14131827

申请日：2012-07-09

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate ,  Hiroko Akiyama ,  Naota Sugiyama ,  Brant U. Kolb ,  Eric G. Larson

IPC: H01L21/56 ,  H01L23/29

CPC classification number: H01L23/296 ,  C08K3/36 ,  C08K9/06 ,  C08L63/00 ,  H01L21/563 ,  H01L23/10 ,  H01L23/293 ,  H01L23/295 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.

Abstract translation: 本发明的半导体封装树脂组合物包括环氧树脂，固化剂，无机颗粒，用含有光聚合官能团的硅烷表面处理的纳米颗粒和光聚合引发剂。