公开(公告)号：US20240400376A1

公开(公告)日：2024-12-05

申请号：US18325018

申请日：2023-05-29

Applicant: AAC Technologies Pte. Ltd.

Inventor： Colin Robert Jenkins ,  Scott Lyall Cargill ,  Euan James Boyd

IPC: B81B3/00

Abstract: An MEMS device, including: a substrate having a back cavity; a diaphragm connected to the substrate and covers the back cavity, the diaphragm includes first and second membranes arranged oppositely, and accommodation space is formed therebetween; a counter electrode in the accommodation space and includes annular beams and first spokes, the annular beams are successively arranged at intervals, and the first spokes extend radially outward from an axis of the counter electrode, an end of the first spokes is connected to the substrate, and two adjacent first spokes and two adjacent annular beams jointly form a first through hole; and a support arranged corresponding to the first through hole, and opposite ends of the support are respectively connected to the first and second membranes. This configuration is more sensitive to sound pressure and is conducive to realizing low-noise microphone while optimizing sensitivity.

公开(公告)号：US20240223966A1

公开(公告)日：2024-07-04

申请号：US18395782

申请日：2023-12-26

Applicant: AAC Technologies Pte. Ltd.

Inventor： Yuwei Liu ,  Colin Robert Jenkins ,  Rui Zhang

IPC: H04R19/04 ,  B81B3/00 ,  H04R7/04 ,  H04R7/18

CPC classification number: H04R19/04 ,  B81B3/0075 ,  H04R7/04 ,  H04R7/18 ,  B81B2201/0257 ,  B81B2203/0127 ,  H04R2201/003

Abstract: A MEMS microphone, includes a substrate with a back cavity, and a capacitive system arranged on the substrate, the capacitive includes a back plate and a diaphragm, a reinforcing portion is located between the diaphragm and the substrate, a projection of an inner surface of the reinforcing portion along a vibration direction of the diaphragm is flush with an inner surface of the back cavity or located in the back cavity, the reinforcing portion includes an etched barrier wall and a sacrificial layer located within the etched barrier wall. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the reliability.