公开(公告)号：US20240400376A1

公开(公告)日：2024-12-05

申请号：US18325018

申请日：2023-05-29

Applicant: AAC Technologies Pte. Ltd.

Inventor： Colin Robert Jenkins ,  Scott Lyall Cargill ,  Euan James Boyd

IPC: B81B3/00

Abstract: An MEMS device, including: a substrate having a back cavity; a diaphragm connected to the substrate and covers the back cavity, the diaphragm includes first and second membranes arranged oppositely, and accommodation space is formed therebetween; a counter electrode in the accommodation space and includes annular beams and first spokes, the annular beams are successively arranged at intervals, and the first spokes extend radially outward from an axis of the counter electrode, an end of the first spokes is connected to the substrate, and two adjacent first spokes and two adjacent annular beams jointly form a first through hole; and a support arranged corresponding to the first through hole, and opposite ends of the support are respectively connected to the first and second membranes. This configuration is more sensitive to sound pressure and is conducive to realizing low-noise microphone while optimizing sensitivity.

公开(公告)号：US20240300806A1

公开(公告)日：2024-09-12

申请号：US18178565

申请日：2023-03-06

Applicant: AAC Technologies Pte. Ltd.

Inventor： Anup Patel ,  Scott Lyall Cargill ,  Euan James Boyd

IPC: B81B3/00 ,  H04R7/02 ,  H04R19/04

CPC classification number: B81B3/0072 ,  H04R7/02 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  H04R2201/003

Abstract: An MEMS diaphragm and an MEMS sensor. The MEMS diaphragm includes: a main diaphragm including a main body sensing portion and beam portions, and the beam portions are connected to an outer edge of the main body sensing portion; an additional material layer provided on the beam portions or provided on both an edge of the main body sensing portion and on the beam portions. The intrinsic tensile stress of the additional material layer is greater than an intrinsic tensile stress of the main body sensing portion. An additional material layer is provided, which mechanically reinforces the diaphragm region experiencing high stress during a pressure pulse, and the intrinsic tensile stress of the additional material layer is greater than the main body sensing portion, thereby ensuring the compliance of the main diaphragm.

公开(公告)号：US20250106561A1

公开(公告)日：2025-03-27

申请号：US18472204

申请日：2023-09-21

Applicant: AAC Technologies Pte. Ltd.

Inventor： Yannick Pierre Kervran ,  Scott Lyall Cargill

IPC: H04R7/10 ,  B81B3/00 ,  H04R19/04

Abstract: A microelectromechanical system membrane includes spacers, counter electrodes, a first diaphragm and a second diaphragm. The spacers and the counter electrodes are at the same level and arranged alternatively on cross sections of the microelectromechanical system membrane. The first diaphragm and the second diaphragm are respectively located on opposite sides of the spacers and hermetically connected. The first diaphragm is provided with first projections spaced arranged in the first direction, and the second diaphragm is provided with second projections spaced arranged alternately in the first direction. The first projections include first front walls and first back walls disposed opposite in the first direction, and the second projections include second front walls and second back walls disposed opposite in the first direction. At least some of the first front and back walls, the second front and back walls are configured to be sub-corrugation structures. The microelectromechanical system membrane has an improved robustness.