公开(公告)号：US20240300806A1

公开(公告)日：2024-09-12

申请号：US18178565

申请日：2023-03-06

Applicant: AAC Technologies Pte. Ltd.

Inventor： Anup Patel ,  Scott Lyall Cargill ,  Euan James Boyd

IPC: B81B3/00 ,  H04R7/02 ,  H04R19/04

CPC classification number: B81B3/0072 ,  H04R7/02 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  H04R2201/003

Abstract: An MEMS diaphragm and an MEMS sensor. The MEMS diaphragm includes: a main diaphragm including a main body sensing portion and beam portions, and the beam portions are connected to an outer edge of the main body sensing portion; an additional material layer provided on the beam portions or provided on both an edge of the main body sensing portion and on the beam portions. The intrinsic tensile stress of the additional material layer is greater than an intrinsic tensile stress of the main body sensing portion. An additional material layer is provided, which mechanically reinforces the diaphragm region experiencing high stress during a pressure pulse, and the intrinsic tensile stress of the additional material layer is greater than the main body sensing portion, thereby ensuring the compliance of the main diaphragm.

公开(公告)号：US20240400376A1

公开(公告)日：2024-12-05

申请号：US18325018

申请日：2023-05-29

Applicant: AAC Technologies Pte. Ltd.

Inventor： Colin Robert Jenkins ,  Scott Lyall Cargill ,  Euan James Boyd

IPC: B81B3/00

Abstract: An MEMS device, including: a substrate having a back cavity; a diaphragm connected to the substrate and covers the back cavity, the diaphragm includes first and second membranes arranged oppositely, and accommodation space is formed therebetween; a counter electrode in the accommodation space and includes annular beams and first spokes, the annular beams are successively arranged at intervals, and the first spokes extend radially outward from an axis of the counter electrode, an end of the first spokes is connected to the substrate, and two adjacent first spokes and two adjacent annular beams jointly form a first through hole; and a support arranged corresponding to the first through hole, and opposite ends of the support are respectively connected to the first and second membranes. This configuration is more sensitive to sound pressure and is conducive to realizing low-noise microphone while optimizing sensitivity.

公开(公告)号：US20240205578A1

公开(公告)日：2024-06-20

申请号：US18084584

申请日：2022-12-20

Applicant: AAC Technologies Pte. Ltd.

Inventor： Euan James Boyd

IPC: H04R1/08 ,  H04R1/28 ,  H04R7/16 ,  H04R7/26

CPC classification number: H04R1/083 ,  H04R1/2869 ,  H04R7/16 ,  H04R7/26

Abstract: A microphone chip and a microphone. The microphone chip includes: a base including an inner cavity; a diaphragm including a diaphragm inner part and a diaphragm outer part that are connected to the diaphragm inner part, the diaphragm being supported on the base by means of the diaphragm outer part, and the diaphragm inner part being arranged to be opposite to the inner cavity; and a limiting member supported on the base and located at two opposite sides of the diaphragm along a vibration direction of the diaphragm, the limiting member being spaced apart from the diaphragm, and the limiting member being configured to limit an amplitude of the diaphragm inner part. When the diaphragm inner part moves to a certain displacement, the limiting member can limit further movement of the diaphragm inner part, thereby reducing a damage risk caused by excessive displacement of the diaphragm under high sound pressure.