公开(公告)号：US09903491B2

公开(公告)日：2018-02-27

申请号：US15076054

申请日：2016-03-21

Applicant: ABB Technology Oy

Inventor： Jaani Karppa ,  Tuomo Kinnunen ,  Pirkka Myllykoski

IPC: F16K17/04 ,  F16K17/36 ,  E04B1/98 ,  F42B39/20 ,  A62C3/00 ,  B64C1/00

CPC classification number: F16K17/36 ,  A62C3/00 ,  B64C2001/009 ,  E04B1/98 ,  F16K17/0413 ,  F16K17/0493 ,  F42B39/20

Abstract: An explosion vent mounted to seal an opening formed on a wall of a closed space comprises a cover being dimensioned to fit on said opening and having a perimeter with an edge adapted to seal the cover against the opening with a sealing element. A spring element is arranged to hold the cover in the opening and the spring element has a direction of spring action. The cover is held by opposite retaining surfaces in the opening and the cover and he retaining surfaces are acting against the spring action of element. The sealing element is positioned against the opening so that the sealing force is directed at least partially crosswise to the direction of the spring action of the spring element.

公开(公告)号：US09953893B2

公开(公告)日：2018-04-24

申请号：US15341773

申请日：2016-11-02

Applicant: ABB Technology Oy

Inventor： Jorma Manninen ,  Pirkka Myllykoski

IPC: H01L23/36 ,  H01L23/42 ,  H01L25/07 ,  H01L29/73 ,  H01L23/367 ,  H01L21/48 ,  H01L23/373 ,  H01L25/00 ,  H01L29/739

CPC classification number: H01L23/3672 ,  H01L21/4882 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L25/07 ,  H01L25/50 ,  H01L29/7393

Abstract: A method of producing a power electronic assembly and a power electronic assembly including a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module including a base plate with a bottom surface, the power electronic assembly includes further a cooling arrangement for cooling the power electronic module, the cooling arrangement including a cooling surface adapted to be attached against the bottom surface of the base plate of the power electronic module, wherein the power electronic assembly includes further a thermal interface material arranged between the bottom surface of the base plate of the power electronic module and the cooling surface of the cooling arrangement to transfer heat from the power electronic module to the cooling arrangement, the thermal interface material includes a metal foil and a solid lubricant coating.

公开(公告)号：US10044287B2

公开(公告)日：2018-08-07

申请号：US14790912

申请日：2015-07-02

Applicant: ABB Technology OY

Inventor： Pirkka Myllykoski ,  Jaani Kärppä

IPC: H02M5/458 ,  H02M7/00 ,  H01B5/02 ,  H01B1/04 ,  H02M7/537

CPC classification number: H02M7/003 ,  H01B1/04 ,  H01B5/02 ,  H02M5/458 ,  H02M7/537

Abstract: A converter system comprising a capacitance (C), an inverter (20) comprising at least two controllable semiconductor switches (S1, S2, S3, S4, S5, S6), and at least two DC conductors (100, 200) connected between the capacitance (C) and the at least two controllable semiconductor switches (S1, S2, S3, S4, S5, S6), wherein at least one of the at least two DC conductors (100, 200) comprises carbon fiber.

公开(公告)号：US20170125321A1

公开(公告)日：2017-05-04

申请号：US15341773

申请日：2016-11-02

Applicant: ABB Technology Oy

Inventor： Jorma Manninen ,  Pirkka Myllykoski

IPC: H01L23/367 ,  H01L25/00 ,  H01L25/07 ,  H01L23/373 ,  H01L29/739 ,  H01L21/48

CPC classification number: H01L23/3672 ,  H01L21/4882 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L25/07 ,  H01L25/50 ,  H01L29/7393

Abstract: A method of producing a power electronic assembly and a power electronic assembly comprising a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module comprising a base plate with a bottom surface, the power electronic assembly comprises further a cooling arrangement for cooling the power electronic module, the cooling arrangement comprising a cooling surface adapted to be attached against the bottom surface of the base plate of the power electronic module, wherein the power electronic assembly comprises further a thermal interface material arranged between the bottom surface of the base plate of the power electronic module and the cooling surface of the cooling arrangement to transfer heat from the power electronic module to the cooling arrangement, the thermal interface material comprises a metal foil and a solid lubricant coating.

公开(公告)号：US20160013736A1

公开(公告)日：2016-01-14

申请号：US14790912

申请日：2015-07-02

Applicant: ABB Technology OY

Inventor： Pirkka Myllykoski ,  Jaani Kärppä

IPC: H02M7/5387

CPC classification number: H02M7/003 ,  H01B1/04 ,  H01B5/02 ,  H02M5/458 ,  H02M7/537

Abstract: A converter system comprising a capacitance (C), an inverter (20) comprising at least two controllable semiconductor switches (S1, S2, S3, S4, S5, S6), and at least two DC conductors (100, 200) connected between the capacitance (C) and the at least two controllable semiconductor switches (S1, S2, S3, S4, S5, S6), wherein at least one of the at least two DC conductors (100, 200) comprises carbon fibre.

Abstract translation: A转换器系统，包括电容（C），包括至少两个可控半导体开关（S1，S2，S3，S4，S5，S6）的逆变器（20）和连接在 电容（C）和所述至少两个可控半导体开关（S1，S2，S3，S4，S5，S6），其中所述至少两个DC导体（100,200）中的至少一个包括碳纤维。