公开(公告)号：US20240034908A1

公开(公告)日：2024-02-01

申请号：US18380228

申请日：2023-10-16

Applicant: ADMATECHS CO., LTD.

Inventor： Yusuke TOMIOKA ,  Tempo NAKAMURA

IPC: C09G1/02

CPC classification number: C09G1/02

Abstract: Provided is a ferrule polishing material suitable for polishing a ferrule. A ferrule polishing material of the present invention solving the above object includes a binder formed from a resin material and abrasive grains dispersed in the binder. The resin material is formed from an epoxy resin. The abrasive grains are contained in an amount of not less than 80% and not greater than 91% with respect to the sum of masses of the abrasive grains and the binder, include small-diameter particles being particles having a particle diameter of not greater than 100 nm, the small-diameter particles being present in an amount of not less than 62.5% and not greater than 80% with respect to the mass of the abrasive grains, and are formed from silica.

公开(公告)号：US20210238421A1

公开(公告)日：2021-08-05

申请号：US17237294

申请日：2021-04-22

Applicant: ADMATECHS CO., LTD.

Inventor： Shingi NOGUCHI ,  Masaru KURAKI ,  Tempo NAKAMURA ,  Yoshinori OKAWAUCHI

IPC: C08L83/06 ,  C08K3/013 ,  C08K3/22

Abstract: Provided is a filler that has a low viscosity when mixed in a resin material and has reduced permittivity and dielectric loss tangent. The filler includes: a metal oxide particle material; and a polyorganosiloxane compound with which a surface treatment is performed on the metal oxide particle material and which is represented by general formula (1): (RO)3Si—(SiR2—O—)n—SiR3 (in general formula (1), each R is independently selected from among alkyl groups having 1 to 4 carbon atoms, and n is not less than 10 and not greater than 200). A resin composition obtained by containing the filler in a resin is suitable for an electronic material.