公开(公告)号：US20240030051A1

公开(公告)日：2024-01-25

申请号：US18479872

申请日：2023-10-03

Applicant: AGC Inc.

Inventor： Yuha KOBAYASHI ,  Yuichi YOSHIDA ,  Keisuke HANASHIMA

IPC: H01L21/67 ,  H01L21/304 ,  H01L21/66 ,  H01L23/15 ,  C03C15/02

CPC classification number: H01L21/67288 ,  H01L21/67253 ,  H01L21/304 ,  H01L22/12 ,  H01L23/15 ,  C03C15/02

Abstract: To suppress lowering of dimensional accuracy. A manufacturing method for a glass substrate is a manufacturing method for the glass substrate that supports a semiconductor device, the manufacturing method including: generating a glass base plate; measuring a thickness, a thickness deviation, and a warpage amount of the glass base plate; screening the glass base plate based on the thickness of the glass base plate; generating a plurality of glass blanks by cutting the screened glass base plate; setting a first polishing condition for the glass blank based on the thickness, the thickness deviation, and the warpage amount of the glass base plate; generating a glass plate by polishing a surface of the glass blank based on the first polishing condition; measuring a thickness, a thickness deviation, and a warpage amount of the glass plate; screening the glass plate based on the thickness of the glass plate; setting a second polishing condition for the glass plate based on the thickness, the thickness deviation, and the warpage amount of the glass plate; and polishing a surface of the screened glass plate based on the second polishing condition to generate a rectangular glass substrate in which a length of a side is equal to or larger than 300 mm and a thickness is equal to or larger than 0.5 mm.

公开(公告)号：US20210343610A1

公开(公告)日：2021-11-04

申请号：US17367762

申请日：2021-07-06

Applicant: AGC Inc.

Inventor： Yu HANAWA ,  Shigeki SAWAMURA ,  Shuhei NOMURA ,  Kazutaka ONO ,  Nobuhiko TAKESHITA ,  Keisuke HANASHIMA

IPC: H01L23/15 ,  C03C27/04 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C17/22 ,  H01L23/13

Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.

公开(公告)号：US20200183081A1

公开(公告)日：2020-06-11

申请号：US16787158

申请日：2020-02-11

Applicant: AGC Inc.

Inventor： Shotaro TAKENOBU ,  Toshihisa OKADA ,  Satoko NOMA ,  Kenta KOBAYASHI ,  Keisuke HANASHIMA ,  Seiki OHARA

IPC: G02B6/02 ,  G02B6/26 ,  G02B6/42

Abstract: The present invention provides a polymer optical waveguide containing: a core; and a cladding having a refractive index lower than that of the core, provided around the core, in which the polymer optical waveguide has a core-coupling section where at least a part of the cladding is not present along a light propagation direction of the polymer optical waveguide and an application type removal film A provided so as to come into contact with the core of the core-coupling section.

公开(公告)号：US20230046712A1

公开(公告)日：2023-02-16

申请号：US17813372

申请日：2022-07-19

Applicant: AGC Inc.

Inventor： Yuha KOBAYASHI ,  Shigeto KUMANO ,  Kaede KATSUNO ,  Keisuke HANASHIMA ,  Kohei HORIUCHI

IPC: C03C23/00

Abstract: A glass substrate 10 has a mark provided on a surface 10A of the glass substrate 10, the mark including plural dots 104, a depth H of each of the dots 104 is 0.5 μm or larger and 7.0 μm or smaller, and an inclination angle of a side surface 104B of each of the dots 104 is 5° or larger and 56° or smaller.