公开(公告)号：US20200338859A1

公开(公告)日：2020-10-29

申请号：US16927444

申请日：2020-07-13

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar Khaselev ,  Bin Mo ,  Monnir Boureghda ,  Michael T. Marczi ,  Bawa Singh

IPC: B32B15/01 ,  B22F5/00 ,  B22F7/04 ,  C22C32/00 ,  C22C49/00 ,  H01L23/00

Abstract: A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.

公开(公告)号：US10710336B2

公开(公告)日：2020-07-14

申请号：US14915067

申请日：2014-08-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar Khaselev ,  Bin Mo ,  Monnir Boureghda ,  Michael T. Marczi ,  Bawa Singh

IPC: B22F7/04 ,  B32B15/01 ,  B22F5/00 ,  C22C32/00 ,  C22C49/00 ,  H01L23/00

Abstract: Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.

公开(公告)号：US10065274B2

公开(公告)日：2018-09-04

申请号：US14909888

申请日：2014-08-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit Pandher ,  Bawa Singh ,  Rahul Raut ,  Sanyogita Arora ,  Ravindra Bhatkal ,  Bin Mo

IPC: B23K35/36 ,  B23K35/26 ,  B23K35/362 ,  B23K35/02 ,  B23K1/012 ,  B23K1/08 ,  B23K1/19 ,  C22C13/00

Abstract: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.