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公开(公告)号：US20160077647A1
公开(公告)日：2016-03-17
申请号：US14952664
申请日：2015-11-25
Applicant: Apple Inc.
Inventor： Steven P. HOTELLING , Joshua G. WURZEL , Steven J. MARTISAUSKAS , Thayne M. MILLER , Kuo-Hua SUNG
CPC classification number: G06F3/0412 , G02F1/13338 , G06F1/1643 , G06F1/1658 , H01L27/323 , H05K1/028 , H05K1/147
Abstract: Flexible circuits for routing signals of a device, such as a touch sensor panel of a touch sensitive device, are provided. The flexible circuit can include a first set of traces for routing a first set of lines and a second set of traces for routing a second set of lines. The first set of traces can couple together the ends of at least a portion of the first set of lines. Additionally, the first set of traces can be non-intersecting or non-overlapping with the second set of traces. The flexible circuit can have a T-shape configuration and can be incorporated within a touch sensitive device, display device, printed circuit board, or the like. The flexible circuit can be placed over another flexible circuit, and can extend onto the device.
Abstract translation: 提供了用于路由设备信号的柔性电路，例如触敏设备的触摸传感器面板。 柔性电路可以包括用于路由第一组线路的第一组迹线和用于路由第二组线路的第二组迹线。 第一组迹线可以将第一组线的至少一部分的端部耦合在一起。 此外，第一组迹线可以与第二组迹线不相交或不重叠。 柔性电路可以具有T形构造，并且可以结合在触敏装置，显示装置，印刷电路板等中。 柔性电路可以放置在另一个柔性电路上，并且可以延伸到设备上。
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公开(公告)号：US20140071417A1
公开(公告)日：2014-03-13
申请号：US13766393
申请日：2013-02-13
Applicant: APPLE INC.
Inventor： Silvio GRESPAN , Shih-Min HSU , Heng-Hsi WU , Kuo-Hua SUNG , Cyrus Y. LIU
CPC classification number: B32B38/0008 , G01B11/14 , G01N33/00 , G03F7/70008 , G06F3/0412 , G06F2203/04103
Abstract: Methods and devices for using liquid optically clear adhesives (LOCAs) are described. A method for detecting uncured LOCA between a first substrate and a second substrate is described. In addition, an improved method for curing a laminated stack up having LOCA between a first substrate and a second substrate is described. The method includes a pre-curing method involving variable exposure of the LOCA. In addition, an improved light emitting diode (LED) unit assembly for exposing a laminated stack up to ultraviolet (UV) light during a pre-curing process is described. A method for testing the LED unit assembly prior to a pre-curing process is described.
Abstract translation: 描述了使用液体光学透明粘合剂（LOCA）的方法和装置。 描述了用于检测第一基板和第二基板之间的未固化LOCA的方法。 另外，描述了在第一基板和第二基板之间固化具有LOCA的叠层叠层的改进方法。 该方法包括涉及LOCA可变暴露的预固化方法。 另外，还描述了一种改进的发光二极管（LED）单元组件，用于在预固化过程中将层压叠层暴露于紫外（UV）光。 描述了在预固化过程之前测试LED单元组件的方法。
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公开(公告)号：US20140321075A1
公开(公告)日：2014-10-30
申请号：US13869881
申请日：2013-04-24
Applicant: APPLE INC.
Inventor： Kuo-Hua SUNG , Silvio GRESPAN
CPC classification number: H05K1/118 , H01R12/62 , H01R43/0249 , H05K1/117 , H05K3/361 , H05K3/363 , H05K2201/09481 , H05K2201/09572 , H05K2201/0969 , H05K2201/0979 , H05K2201/09854 , H05K2203/0126
Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.
Abstract translation: 所描述的实施例通常涉及电子设备，更具体地涉及用于在电子设备内的组件之间形成机械和电连接的方法。 在一个实施例中，诸如柔性电缆的互连部件附接到诸如印刷电路板的基板。 可以在互连部件中产生穿过位于互连部件的一端上的接合焊盘的多个孔。 然后可以将互连部件与衬底上的接合焊盘对准，并使互连部件上的接合焊盘背离衬底。 可以通过互连部件将导电化合物注入孔中，在接合焊盘之间形成机械和电连接。 在一些实施例中，可以使用粘合剂层来进一步加强互连部件和基底之间的结合。
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