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公开(公告)号：US20210382525A1
公开(公告)日：2021-12-09
申请号：US17403206
申请日：2021-08-16
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US20140294656A1
公开(公告)日：2014-10-02
申请号：US13875637
申请日：2012-09-11
Applicant: APPLE INC.
Inventor： Michael Brickner , Wayne Cowan , Brett A. Rosenthal , Richard Heley , Mathias W. Schmidt
IPC: H01R43/18
CPC classification number: H01R43/18 , B22F3/225 , B22F5/10 , B22F2998/10 , H01R13/659 , H01R24/60 , H01R43/16 , B22F3/1021 , B22F3/10 , B22F3/162
Abstract: Frames for plug connectors capable of being a reduced size may include features to support contacts, house circuitry for coupling with the contacts, facilitate the flow of molten material during the molding of the frame, and allow for ease of insertion and removal of the plug connector to and from a corresponding receptacle connector. For example, a frame may include ledges, interlocks and rounded and tapered openings. Methods for manufacturing the frame are also provided.
Abstract translation: 能够减小尺寸的插头连接器的框架可以包括支撑触点的特征，用于与触点耦合的住宅电路，在框架的模制期间促进熔融材料的流动，并且允许容易地插入和移除插头连接器 到对应的插座连接器。 例如，框架可以包括凸缘，互锁和圆形和锥形开口。 还提供了制造框架的方法。
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公开(公告)号：US20190294215A1
公开(公告)日：2019-09-26
申请号：US16439163
申请日：2019-06-12
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US10353436B2
公开(公告)日：2019-07-16
申请号：US15134621
申请日：2016-04-21
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US20160234360A1
公开(公告)日：2016-08-11
申请号：US15134621
申请日：2016-04-21
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
CPC classification number: H05K5/0247 , G06F1/1626 , G06F1/1656 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H01Q1/42 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/03 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
Abstract translation: 这旨在通过连接多个元件构建的部件上提供化妆品。 可以将单个制造过程（诸如机械加工或研磨）应用于连接的元件以从部分或全部元件中移除材料，并且在部件的各个元件之间的界面之间形成平滑且连续的表面。 在某些情况下，材料去除过程的设置可以根据元件的材料进行调整。 例如，可以基于每个元件材料的制造或机械性质来调整设置。
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Patent Agency Ranking
公开(公告)号：US11099609B2
公开(公告)日：2021-08-24
申请号：US16439163
申请日：2019-06-12
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US10754388B2
公开(公告)日：2020-08-25
申请号：US16405239
申请日：2019-05-07
Applicant: Apple Inc.
Inventor： Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David A. Pakula , Tang Yew Tan
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号：US20180120904A1
公开(公告)日：2018-05-03
申请号：US15829372
申请日：2017-12-01
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Mattew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/03 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US09357665B2
公开(公告)日：2016-05-31
申请号：US14064785
申请日：2013-10-28
Applicant: Apple Inc.
Inventor： Scott A. Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David A. Pakula , Tang Yew Tan
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/03 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号：US20140054058A1
公开(公告)日：2014-02-27
申请号：US14064785
申请日：2013-10-28
Applicant: Apple Inc.
Inventor： Scott A. Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David A. Pakula , Tang Yew Tan
IPC: H05K5/03
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/03 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
Abstract translation: 这是针对电子设备外壳。 壳体包括形成设备的外表面的外周构件，并且连接有内部平台。 电子设备部件可以组装到内部平台的一个或两个表面。 外壳可以包括组装到外周构件的相对表面的前盖组件和后盖组件，以保持电子设备部件。 一个或两个盖组件可以包括窗口，显示器电路可以通过该窗口向设备的用户提供内容。
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