公开(公告)号：US20190259647A1

公开(公告)日：2019-08-22

申请号：US16273808

申请日：2019-02-12

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  ENG SHENG PEH ,  FANG JIE LIM ,  KARRTHIK PARATHITHASAN ,  ANAND MAHADEV ,  SHOJU VAYYAPRON ,  CHAI BOON XIAN

IPC: H01L21/683 ,  C23C14/50

Abstract: Embodiments of a process kit for processing reduced size substrates are provided herein. In some embodiments, a process kit includes a deposition ring having an annular body; and a plurality of protrusions extending upwardly from the annular body and disposed about and equidistant from a central axis of the annular body, wherein an angle between a first protrusion and a second protrusion is between about 140° and about 180°.

公开(公告)号：US20190259635A1

公开(公告)日：2019-08-22

申请号：US16273390

申请日：2019-02-12

Applicant: APPLIED MATERIALS, INC.

Inventor： KARRTHIK PARATHITHASAN ,  FANG JIE LIM ,  ANAND MAHADEV ,  SHOJU VAYYAPRON ,  SRISKANTHARAJAH THIRUNAVUKARASU ,  ENG SHENG PEH

IPC: H01L21/673 ,  H01L21/02 ,  H01L21/683

Abstract: Embodiments of a process kit for processing reduced size substrates are provided herein. In some embodiments, a process kit includes a substrate carrier having a pocket configured to hold a substrate, wherein the pocket extends partially through a thickness of the substrate carrier; and wherein the pocket includes an annular trench disposed at a periphery of a floor of the pocket.

公开(公告)号：US20190252235A1

公开(公告)日：2019-08-15

申请号：US16272811

申请日：2019-02-11

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  ENG SHENG PEH ,  KARRTHIK PARATHITHASAN ,  FANG JIE LIM

IPC: H01L21/687 ,  H01L21/683

CPC classification number: H01L21/68707 ,  H01L21/6838 ,  H01L21/68771 ,  H01L21/68785

Abstract: Embodiments of methods and apparatus for handling substrates of different sizes are provided herein. In some embodiments, an apparatus for handling substrates of different sizes includes: a pair of end effectors having a first set of contact pads configured to support a substrate having a first size and a second set of contact pads configured to support a substrate having a second size, smaller than the first size.

公开(公告)号：US20200211883A1

公开(公告)日：2020-07-02

申请号：US16286273

申请日：2019-02-26

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  ARVIND SUNDARRAJAN ,  KARRTHIK PARATHITHASAN ,  QI JIE PENG ,  MANORAJH ARUNAKIRI

IPC: H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: Methods for bonding and de-bonding a thin substrate film to a carrier plate are provided herein. In some embodiments, a method of processing a semiconductor substrate includes applying a polymer layer that is non-adhesive to a carrier plate formed of a dielectric material. A second layer is then applied to the polymer layer. One or more redistribution layers are then formed on the second layer. The second layer is then separated from the carrier plate via at least one of magnetic induction heating, infrared exposure, or electrostatic repulsion.

公开(公告)号：US20190244845A1

公开(公告)日：2019-08-08

申请号：US15956481

申请日：2018-04-18

Applicant: APPLIED MATERIALS, INC.

Inventor： KARRTHIK PARATHITHASAN ,  FANG JIE LIM ,  SRISKANTHARAJAH THIRUNAVUKARASU ,  ENG SHENG PEH

IPC: H01L21/673 ,  H01L21/67

CPC classification number: H01L21/67376 ,  H01L21/67126

Abstract: A bridging front opening unified pod (FOUP) is provided herein. In some embodiments, the bridging FOUP includes a bottom floor, side walls, a ceiling and a back wall that forms an enclosure volume having a front opening, a plurality of supports coupled to the side walls and extending into the enclosure volume, wherein the plurality of supports are configured to support a substrate carrier, a base plate assembly comprising a base plate coupled to the bottom floor, a pair of L-brackets coupled to the base plate, wherein each L-brackets includes a short lift pin, a long lift pin coupled to the base plate, wherein the height of the short lift pins and the long lift pin is selected such that the substrate is kept level when disposed thereon, and a docking support disposed proximate the base plate assembly and configured to support a substrate carrier.