公开(公告)号：US20190287758A1

公开(公告)日：2019-09-19

申请号：US15925739

申请日：2018-03-19

Applicant: APPLIED MATERIALS, INC.

Inventor： Yaoling PAN ,  Vijaykumar KRITHIVASAN ,  Shimin MAO ,  Kelvin CHAN ,  Michael D. WILLWERTH ,  Anantha SUBRAMANI ,  Ashish GOEL ,  Chih-shun LU ,  Philip Allan KRAUS ,  Patrick John TAE ,  Leonard TEDESCHI

IPC: H01J37/244 ,  H01L21/67 ,  H01L41/047 ,  H01L41/053 ,  H01L41/31 ,  H01L41/29 ,  H01L41/04 ,  H01J37/32

Abstract: Embodiments described herein include a resonant process monitor and methods of forming such a resonant process monitor. In an embodiment, the resonant process monitor includes a frame that has a first opening and a second opening. In an embodiment, a resonant body seals the first opening of the frame. In an embodiment, a first electrode on a first surface of the resonant body contacts the frame and a second electrode is on a second surface of the resonant body. Embodiments also include a back plate that seals the second opening of the frame. In an embodiment the back plate is mechanically coupled to the frame, and the resonant body, the back plate, and interior surfaces of the frame define a cavity.

公开(公告)号：US20180335393A1

公开(公告)日：2018-11-22

申请号：US16051365

申请日：2018-07-31

Applicant: APPLIED MATERIALS, INC.

Inventor： Leonard TEDESCHI ,  Kartik RAMASWAMY

IPC: G01N21/94 ,  H01L21/66 ,  G01N21/95 ,  H01L21/67

CPC classification number: G01N21/94 ,  G01N21/9501 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/20

Abstract: Embodiments include devices and methods for detecting particles in a wafer processing tool. In an embodiment, a particle monitoring device having a wafer form factor includes several micro sensors capable of operating in all pressure regimes, e.g., under vacuum conditions. The particle monitoring device may include a clock to output a time value when a parameter of a micro sensor changes in response to receiving a particle within a chamber of the wafer processing tool. A location of the micro sensor or the time value may be used to determine a source of the particle. Other embodiments are also described and claimed.

公开(公告)号：US20180294200A1

公开(公告)日：2018-10-11

申请号：US15480337

申请日：2017-04-05

Applicant: APPLIED MATERIALS, INC.

Inventor： Leonard TEDESCHI ,  Benjamin SCHWARZ ,  Changhun LEE ,  Ping Han Hsieh ,  Adauto DIAZ ,  Daniel T. McCormick

IPC: H01L21/66

Abstract: Embodiments may also include a residual chemical reaction diagnostic device. The residual chemical reaction diagnostic device may include a substrate and a residual chemical reaction sensor formed on the substrate. In an embodiment, the residual chemical reaction sensor provides electrical outputs in response to the presence of residual chemical reactions. In an embodiment, the substrate is a device substrate, and the sensor is formed in a scribe line of the device substrate. In an alternative embodiment, the substrate is a process development substrate. In some embodiments, the residual chemical reaction sensor includes, a first probe pad, wherein a plurality of first arms extend out from the first probe pad, and a second probe pad, wherein a plurality of second arms extend out from the second probe pad and are interdigitated with the first arms.