公开(公告)号：US20250105705A1

公开(公告)日：2025-03-27

申请号：US18893498

申请日：2024-09-23

Applicant: ASM IP Holding B.V.

Inventor： Mario Gonzalez ,  Joseph Kraus ,  Dongyang Chen ,  Shaofeng Chen

IPC: H02K9/26 ,  B25J9/10 ,  H01L21/67 ,  H01L21/687 ,  H02K21/14

Abstract: A motor arrangement includes a stator body, a rotor body, a permanent magnet and a fluid conduit. The stator body defines a rotary axis and has a bore. The rotor body is supported for rotary movement about the rotary axis in the bore and is separated from the stator body by a gap. The permanent magnet is arranged within the gap and is fixed to one of the stator body and the rotor body. The fluid conduit is supported above the gap and has an outlet in fluid communication with the gap to separate the permanent magnet from an infiltrant fluid resident within an atmosphere above of the gap by issuing a barrier fluid into the atmosphere above the gap and gravimetrically flowing the barrier fluid into the gap. Semiconductor processing systems, barrier fluid kits, and methods of purging motor arrangements are also described.

公开(公告)号：US20230197472A1

公开(公告)日：2023-06-22

申请号：US18065869

申请日：2022-12-14

Applicant: ASM IP Holding, B.V.

Inventor： Joseph Kraus ,  Mario Gonzalez ,  Mandar Deshpande

IPC: H01L21/67 ,  C23C16/44

CPC classification number: H01L21/67063 ,  C23C16/4408 ,  H01L21/67167 ,  H01L21/67201

Abstract: A semiconductor processing system includes a front-end module connected to a load lock, a process module coupled to the front-end module by the load lock, a purge/vent fluid inlet conduit connected to the load lock, a heater element coupled to the load lock by the purge/vent fluid inlet conduit, and a controller. The controller is operably connected to the heater element and responsive to instructions recorded on a memory to transfer a substrate carrying substrate moisture from the front-end module into the load lock, heat a purge/vent fluid using the heater element, flow the heated purge/vent fluid into the load lock using the purge/vent fluid inlet conduit, remove the moisture from the load lock using the heated purge/vent fluid, and transfer the substrate from the load lock to the process module for processing using the process module. Moisture control methods and heated purge/vent fluid arrangements are also described.