公开(公告)号：US12243757B2

公开(公告)日：2025-03-04

申请号：US17323288

申请日：2021-05-18

Applicant: ASM IP Holding B.V.

Inventor： Jeroen de Jonge ,  Sumit Sachdeva ,  Lucian Jdira ,  Julien Laurentius Antonius Maria Keijser ,  Theodorus G. M. Oosterlaken

IPC: H01L21/67 ,  F27B17/00 ,  F27D5/00 ,  F27D9/00 ,  H01L21/673

Abstract: The disclosure relates to a flange for a process tube in an apparatus for processing substrates, e.g., a vertical furnace. The flange may be provided with an opening for in use giving access to the process chamber of the process tube and a cooling channel for allowing a cooling fluid to flow there through and cool the flange. A material with a heat conductivity between 0.1 and 40 W/m K may be at least partially provided in between the cooling fluid and the rest of the flange.

公开(公告)号：US20210366742A1

公开(公告)日：2021-11-25

申请号：US17323288

申请日：2021-05-18

Applicant: ASM IP Holding B.V.

Inventor： Jeroen de Jonge ,  Sumit Sachdeva ,  Lucian Jdira ,  Julien Laurentius Antonius Maria Keijser ,  Theodorus G.M. Oosterlaken

IPC: H01L21/67 ,  H01L21/673 ,  F27B17/00 ,  F27D5/00

Abstract: The disclosure relates to a flange for a process tube in an apparatus for processing substrates, e.g., a vertical furnace. The flange may be provided with an opening for in use giving access to the process chamber of the process tube and a cooling channel for allowing a cooling fluid to flow there through and cool the flange. A material with a heat conductivity between 0.1 and 40 W/m K may be at least partially provided in between the cooling fluid and the rest of the flange.

公开(公告)号：US20210384046A1

公开(公告)日：2021-12-09

申请号：US17336494

申请日：2021-06-02

Applicant: ASM IP Holding B.V.

Inventor： Gijsbert Hendrik Ronner ,  Christianus G.M. de Ridder ,  Theodorus G.M. Oosterlaken ,  Klaas P. Boonstra ,  Jeroen de Jonge ,  Lucian Jdira ,  Chaggai Shmuel Ganani

IPC: H01L21/67 ,  B65G47/90

Abstract: The disclosure relates to a substrate processing apparatus for processing a plurality of substrates. The apparatus comprising a reactor mounted in the apparatus and configured for processing substrates and a reactor mover for moving the reactor for maintenance. The reactor mover is constructed and arranged with a lift to move the reactor to a lower height to allow for access to the reactor by a maintenance worker.

公开(公告)号：US12051602B2

公开(公告)日：2024-07-30

申请号：US17244235

申请日：2021-04-29

Applicant: ASM IP Holding B.V.

Inventor： Jeroen de Jonge

IPC: H01L21/67 ,  B05B5/08 ,  H01L21/677 ,  H01L21/687 ,  B05B13/02

CPC classification number: H01L21/67098 ,  B05B5/082 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/68707 ,  B05B13/02

Abstract: The disclosure relates to a semiconductor processing system for processing semiconductor substrates and provided with a housing formed by a wall. The system may further comprise a processing module and a cassette module, the cassette module located adjacent the processing module. An electronics module may be provided with a support for mounting electronic components, whereby the electronics module is located behind a door in the wall of the system to create access for maintenance. The electronic components have a straight mounting basis for mounting of the electronics components whereby the mounting basis is mounted in the system under an angle between 10 and 80 degrees with respect to the door when the door is closed.

公开(公告)号：US20210343556A1

公开(公告)日：2021-11-04

申请号：US17244235

申请日：2021-04-29

Applicant: ASM IP Holding B.V.

Inventor： Jeroen de Jonge

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: The disclosure relates to a semiconductor processing system for processing semiconductor substrates and provided with a housing formed by a wall. The system may further comprise a processing module and a cassette module, the cassette module located adjacent the processing module. An electronics module may be provided with a support for mounting electronic components, whereby the electronics module is located behind a door in the wall of the system to create access for maintenance. The electronic components have a straight mounting basis for mounting of the electronics components whereby the mounting basis is mounted in the system under an angle between 10 and 80 degrees with respect to the door when the door is closed.