On chip sensor for wafer overlay measurement

    公开(公告)号:US12066762B2

    公开(公告)日:2024-08-20

    申请号:US17637942

    申请日:2020-08-05

    CPC classification number: G03F7/70633 G02B6/1225 G02B26/0833

    Abstract: A sensor apparatus includes a sensor chip, an illumination system, a first optical system, a second optical system, and a detector system. The illumination system is coupled to the sensor chip and transmits an illumination beam along an illumination path. The first optical system is coupled to the sensor chip and includes a first integrated optic to configure and transmit the illumination beam toward a diffraction target on a substrate, disposed adjacent to the sensor chip, and generate a signal beam including diffraction order sub-beams generated from the diffraction target. The second optical system is coupled to the sensor chip and includes a second integrated optic to collect and transmit the signal beam from a first side to a second side of the sensor chip. The detector system is configured to measure a characteristic of the diffraction target based on the signal beam transmitted by the second optical system.

    Reticle sub-field thermal control

    公开(公告)号:US11500298B2

    公开(公告)日:2022-11-15

    申请号:US17415715

    申请日:2019-12-12

    Abstract: An apparatus for reticle sub-field thermal control in a lithography system is disclosed. The apparatus includes a clamp configured to fix an object. The clamp includes a plurality of gas distribution features that are spatially arranged in a pattern. The apparatus further includes a gas pressure controller configured to individually control a gas flow rate through each of the plurality of gas distribution features to spatially modulate a gas pressure distribution in a space between the clamp and the object. The gas distribution features include a plurality of trenches or holes arranged in an array form.

    Monolithic particle inspection device

    公开(公告)号:US12298257B2

    公开(公告)日:2025-05-13

    申请号:US18012801

    申请日:2021-06-09

    Abstract: Systems, apparatuses, and methods are provided for detecting a particle on a substrate surface. An example method can include receiving, by a grating structure, coherent radiation from a radiation source. The method can further include generating, by the grating structure, a focused coherent radiation beam based on the coherent radiation. The method can further include transmitting, by the grating structure, the focused coherent radiation beam toward a region of a surface of a substrate. The method can further include receiving, by the grating structure, photons scattered from the region in response to illuminating the region with the focused coherent radiation beam. The method can further include measuring, by a photodetector, the photons received by the grating structure. The method can further include generating, by the photodetector and based on the measured photons, an electronic signal for detecting a particle located in the region of the surface of the substrate.

    Spectrometric metrology systems based on multimode interference and lithographic apparatus

    公开(公告)号:US12135505B2

    公开(公告)日:2024-11-05

    申请号:US18016225

    申请日:2021-06-29

    Abstract: A metrology system comprises a radiation source, an optical element, first and second detectors, an integrated optical device comprising a multimode waveguide, and a processor. The radiation source generates radiation. The optical element directs radiation toward a target to generate scattered radiation from the target. The first detector receives a first portion of the scattered radiation and generates a first detection signal based on the received first portion. The multimode waveguide interferes a second portion of the scattered radiation using modes of the multimode waveguide. The second detector receives the interfered second portion and generates a second detection signal based on the received interfered second portion. The processor receives the first and second detection signals. The processor analyzes the received first portion, the received interfered second portion, and a propagation property of the multimode waveguide. The processor determines the property of the target based on the analysis.

    Self-referencing integrated alignment sensor

    公开(公告)号:US12216414B2

    公开(公告)日:2025-02-04

    申请号:US18012799

    申请日:2021-06-09

    Abstract: Systems, apparatuses, and methods are provided for determining the alignment of a substrate. An example method can include emitting a multi-wavelength radiation beam including a first wavelength and a second wavelength toward a region of a surface of a substrate. The example method can further include measuring a first diffracted radiation beam indicative of first order diffraction at the first wavelength in response to an irradiation of the region by the multi-wavelength radiation beam. The example method can further include measuring a second diffracted radiation beam indicative of first order diffraction at the second wavelength in response to the irradiation of the region by the multi-wavelength radiation beam. Subsequently, the example method can include generating, based on the measured first set of photons and the measured second set of photons, an electronic signal for use in determining an alignment position of the substrate.

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