公开(公告)号：USRE48903E1

公开(公告)日：2022-01-25

申请号：US16281179

申请日：2019-02-21

Applicant: ASML Netherlands B.V.

Inventor： Vincent Sylvester Kuiper ,  Erwin Slot ,  Marcel Nicolaas Jacobus Van Kervinck ,  Guido De Boer ,  Hendrik Jan De Jong

IPC: G03F7/20 ,  H01L21/677 ,  H01L21/67 ,  G03B27/60 ,  G03B27/58

Abstract: An apparatus for transferring a target, such as a substrate or a substrate support structure onto which a substrate has been clamped, from a substrate transfer system to a vacuum chamber of a lithography system. The apparatus comprises a load lock chamber for transferring the target into and out of the vacuum chamber. The load lock chamber comprises a first wall with a first passage providing access between a robot space and the interior of the load lock chamber, a second wall with a second passage providing access between the interior of the load lock chamber and the vacuum chamber, and plurality of handling robots for transferring the targets comprising: a first handling robot movable within the robot space to access the substrate transfer system and the first passage; and a second handling robot movable within the load lock chamber to access the first passage and the second passage.

公开(公告)号：USRE49725E1

公开(公告)日：2023-11-14

申请号：US17025997

申请日：2020-09-18

Applicant: ASML Netherlands B.V.

Inventor： Hendrik Jan De Jong ,  Marco Jan-Jaco Wieland

IPC: G03F7/20 ,  H01L21/687 ,  H01L21/683 ,  G03F7/00 ,  H01L21/67 ,  H01L21/677

CPC classification number: G03F7/707 ,  H01L21/6776 ,  H01L21/67173 ,  H01L21/67706 ,  H01L21/67724 ,  H01L21/67748 ,  H01L21/67778 ,  H01L21/683 ,  H01L21/687 ,  H01L21/6838 ,  H01L21/6875 ,  H01L21/68707 ,  H01L21/68742 ,  H01L21/68785 ,  Y10T29/49815 ,  Y10T29/49998 ,  Y10T29/53

Abstract: The invention relates to a substrate handling and exposure arrangement comprising a plurality of lithography apparatus, a clamp preparation unit for clamping a wafer on a wafer support structure, a wafer track, wherein the clamp preparation unit is configured for accepting a wafer from the wafer track, and an additional wafer track for transferring the clamp towards the plurality of lithography apparatus.