公开(公告)号：US20230352330A1

公开(公告)日：2023-11-02

申请号：US18347971

申请日：2023-07-06

Applicant: Samsung Display Co., LTD.

Inventor： Heungyeol NA ,  Mingyoun KANG ,  Dongwon SEOL

IPC: H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  B25J19/02 ,  G06T7/70 ,  B25J9/16

CPC classification number: H01L21/67736 ,  H01L21/681 ,  H01L21/687 ,  H01L21/67706 ,  H01L21/67766 ,  B25J19/023 ,  G06T7/70 ,  B25J9/1697 ,  Y10T29/49004 ,  Y10T29/53261

Abstract: A system for transferring a substrate includes a substrate transporter at which is captured a first image with which a position of the substrate at the substrate transporter is determined; a tray at which is captured a second image with which a position of each of a plurality of substrates relative to the tray is determined; a substrate mover with which the substrate is movable in a revolving manner between the substrate transporter and the tray, the substrate mover including: an arm portion movable in the revolving manner between the substrate transporter and the tray, and a substrate securing portion movable together with the arm portion; and an imager with which the first image and the second image are captured, the imager connected to the arm portion and movable in the revolving manner between the substrate transporter and the tray together with the arm portion.

公开(公告)号：US20190244804A1

公开(公告)日：2019-08-08

申请号：US16390691

申请日：2019-04-22

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Fu-Ming Huang ,  Liang-Guang Chen ,  Ting-Kui Chang ,  Chun-Chieh Lin

IPC: H01L21/02 ,  H01L21/67 ,  B08B1/00 ,  B08B1/04 ,  H01L21/687 ,  B08B3/04 ,  H01L21/306

CPC classification number: H01L21/02043 ,  B08B1/002 ,  B08B1/04 ,  B08B3/04 ,  H01L21/02065 ,  H01L21/02074 ,  H01L21/30625 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67092 ,  H01L21/687

Abstract: A method includes performing a first post Chemical Mechanical Polish (CMP) cleaning on a wafer using a first brush. The first brush rotates to clean the wafer. The method further includes performing a second post-CMP cleaning on the wafer using a second brush. The second brush rotates to clean the wafer. The first post-CMP cleaning and the second post-CMP cleaning are performed simultaneously.

公开(公告)号：US20190232431A1

公开(公告)日：2019-08-01

申请号：US16253872

申请日：2019-01-22

Applicant: DISCO CORPORATION

Inventor： Yuji HADANO ,  Koichi KATAYAMA ,  Keiji NOMARU

IPC: B23K26/364 ,  B23K26/402 ,  B23K26/53 ,  B23K26/146 ,  H01L21/8258 ,  B23K26/16

CPC classification number: B23K26/364 ,  B23K26/146 ,  B23K26/16 ,  B23K26/402 ,  B23K26/53 ,  B23K2101/40 ,  H01L21/687 ,  H01L21/8258

Abstract: A laser processing method for performing groove processing by applying to a workpiece a laser beam of such a wavelength as to be absorbed in the workpiece includes: a protective member disposing step of disposing a protective member on an upper surface of the workpiece; a liquid layer forming step of forming a liquid layer on the upper surface of the workpiece; a laser beam applying step of applying the laser beam through the liquid layer to subject the upper surface of the workpiece to groove processing and to produce minute bubbles; and a debris removing step of removing debris from inside of grooves by rupture of the bubbles.

公开(公告)号：US20180308740A1

公开(公告)日：2018-10-25

申请号：US15766740

申请日：2016-09-08

Applicant: ASML NETHERLANDS B.V.

Inventor： Satish ACHANTA ,  Tiannan GUAN ,  Raymond Wilhelmus Louis LAFARRE ,  Ilya MALAKHOVSKY ,  Bas Johannes Petrus ROSET ,  Siegfried Alexander TROMP ,  Johannes Petrus Martinus Bernardus VERMEULEN

IPC: H01L21/687 ,  G03F7/20 ,  G03F7/00

CPC classification number: H01L21/68742 ,  G03F7/0002 ,  G03F7/707 ,  G03F7/70708 ,  G03F7/70716 ,  G03F7/70725 ,  G03F7/70733 ,  G03F7/70783 ,  H01L21/683 ,  H01L21/6831 ,  H01L21/687 ,  H01L21/6875

Abstract: A substrate table to support a substrate, the substrate table including a main body, burls extending from the main body and having first upper ends that define a support surface to support the substrate, and support pins having second upper ends. The support pins are movable between a retracted position and an extended position. The support pins are arranged to support the substrate in the extended position. The support pins are arranged to be switched to a first stiffness mode and a second stiffness mode. In the first stiffness mode, the support pins have a first stiffness in a direction parallel to the support surface. In the second stiffness mode, the support pins have a second stiffness in the direction parallel to the support surface. The first stiffness is different from the second stiffness.

公开(公告)号：US20180197767A1

公开(公告)日：2018-07-12

申请号：US15686360

申请日：2017-08-25

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： HAN YUE ,  Dongni LIU ,  Xiaochuan CHEN ,  Shengji YANG ,  Lei WANG ,  Jie FU ,  Pengcheng LU ,  Li Xiao

IPC: H01L21/687 ,  B25J15/00 ,  B65G61/00

CPC classification number: H05K13/0404 ,  B25J7/00 ,  B25J15/0014 ,  B25J15/0028 ,  B25J15/0052 ,  B25J15/0206 ,  B25J15/10 ,  B25J15/12 ,  B65G47/907 ,  B65G61/00 ,  H01L21/687 ,  H01L21/68707 ,  H01L21/68728

Abstract: A transfer apparatus and a transfer method are provided. The transfer apparatus includes a transfer substrate; and a plurality of gripping members arranged in an array and disposed on the transfer substrate. Each gripping member includes at least two gripping arms each of which has a first end disposed on the transfer substrate, and gripping legs connected with second ends of the gripping arms and configured to switch between a gripping position and a released position.

公开(公告)号：US09947560B1

公开(公告)日：2018-04-17

申请号：US15358513

申请日：2016-11-22

Applicant: Xilinx, Inc.

Inventor： Mohsen H. Mardi ,  David Tan ,  Gamal Refai-Ahmed

IPC: H01L21/67 ,  H01L21/48 ,  H01L23/04 ,  H01L23/498 ,  H01L23/367 ,  H01L21/687

CPC classification number: H01L21/67121 ,  H01L21/4817 ,  H01L21/67098 ,  H01L21/687 ,  H01L21/68735 ,  H01L23/04 ,  H01L23/3675 ,  H01L23/49811 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: An integrated circuit (IC) package, assembly tool and method for assembling an IC package are described herein. In a first example, an IC package is provided that includes a package substrate, at least a first integrated circuit (IC) die and a cover. The first integrated circuit (IC) die is mechanically and electrically coupled to the package substrate via solder connections. The cover is bonded to the package substrate. The cover encloses the first IC die and is laterally offset from a peripheral edge of the package substrate.

公开(公告)号：US20180017874A1

公开(公告)日：2018-01-18

申请号：US15642782

申请日：2017-07-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Satoshi Iwatani

IPC: G03F7/20

CPC classification number: G03F7/70716 ,  G03F7/0002 ,  G03F7/707 ,  G03F7/70783 ,  G03F7/708 ,  G03F7/70808 ,  G03F7/70866 ,  G03F7/70875 ,  H01L21/683 ,  H01L21/687

Abstract: The present invention provides a stage apparatus including a plate, wherein the plate includes a first plate member, a second plate member, and a third plate member, at least one surface out of a first surface of the first plate member on a side of the second plate member and a second surface of the second plate member on a side of the first plate member includes a first concave portion configured to form a first channel extending in a direction along the surface, at least one surface out of a third surface of the second plate member on a side of the third plate member and a fourth surface of the third plate member on the side of the second plate member includes a second concave portion configured to form a second channel extending in a direction along the surface.

公开(公告)号：US09786535B2

公开(公告)日：2017-10-10

申请号：US14556233

申请日：2014-11-30

Applicant: GUDENG PRECISION INDUSTRIAL CO., LTD.

Inventor： Hui-Ming Pao ,  Cheng-Hsin Chen ,  Po-Ting Lee ,  Ming-Chien Chiu ,  Tien-Jui Lin

IPC: B08B3/00 ,  H01L21/677 ,  H01L21/673 ,  H01L21/68 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67748 ,  H01L21/67259 ,  H01L21/67353 ,  H01L21/67393 ,  H01L21/6773 ,  H01L21/67736 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/687

Abstract: The present invention relates to a wafer transport system and a method of operating the same. The wafer transport system comprises at least one semiconductor apparatus, a track, a transfer device, a positioning device, a carrier and a cleaning device. The wafer transport system transports wafers along the at least one semiconductor apparatus via the carrier riding on the track. The transfer device transfers the wafers from the carrier to the at least one semiconductor apparatus. The positioning device identifies and controls the position of the carrier on the track. The cleaning device maintains the cleanliness of the wafers. The present invention provides advantages for improving the yield rate of a wafer, shortening the fabrication time of a wafer, and offering the flexibility and the extendibility to a wafer transport system.

公开(公告)号：US20170256418A1

公开(公告)日：2017-09-07

申请号：US15061860

申请日：2016-03-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： SHU-HAO CHANG ,  KUO-CHANG KAU ,  KEVIN HUANG ,  JENG-HORNG CHEN

IPC: H01L21/311 ,  H01L21/687 ,  G03F7/20 ,  H01L21/027

CPC classification number: G03F7/70341 ,  B05D1/60 ,  B05D3/06 ,  B05D3/061 ,  B05D3/068 ,  G03F7/0042 ,  G03F7/038 ,  G03F7/11 ,  G03F7/167 ,  G03F7/2004 ,  G03F7/201 ,  G03F7/2037 ,  G03F7/2039 ,  G03F7/38 ,  G03F7/40 ,  G03F7/70325 ,  H01L21/02118 ,  H01L21/02277 ,  H01L21/0271 ,  H01L21/0274 ,  H01L21/0277 ,  H01L21/31111 ,  H01L21/31133 ,  H01L21/31144 ,  H01L21/687 ,  H01L21/68764

Abstract: Disclosed is a method for lithography patterning. The method includes providing a substrate, forming a deposition enhancement layer (DEL) over the substrate, and flowing an organic gas near a surface of the DEL. During the flowing of the organic gas, the method further includes irradiating the DEL and the organic gas with a patterned radiation. Elements of the organic gas polymerize upon the patterned radiation, thereby forming a resist pattern over the DEL. The method further includes etching the DEL with the resist pattern as an etch mask, thereby forming a patterned DEL.

公开(公告)号：US09740109B2

公开(公告)日：2017-08-22

申请号：US14947702

申请日：2015-11-20

Applicant: CANON KABUSHIKI KAISHA

Inventor： Naoki Funabashi

IPC: H01L21/683 ,  H01L21/687 ,  G03F7/20

CPC classification number: G03F7/707 ,  G03F7/70783 ,  H01L21/683 ,  H01L21/6838 ,  H01L21/687

Abstract: A holding device includes a holding member having holes for evacuating air in a space between a substrate and the holding member and an annular seal member on a lower surface of a stepped portion of the holding member for defining the space. A first region is the area of a figure having the same center as that of a plane figure of a surface of the holding member and obtained by reducing the plane figure's size by ⅔ or more and ⅘ or less. A second region is between the first region and the seal member. The holes are formed to satisfy a relationship of (total hole area in second region/area of second region)>(total hole area in sum region of first and second regions/area of sum region of first and second regions) and communicate with a pipe at a position corresponding to the first region of the holding member.