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公开(公告)号:US20180343430A1
公开(公告)日:2018-11-29
申请号:US15605474
申请日:2017-05-25
Applicant: Advanced Micro Devices, Inc.
Inventor: Michael L. Schmit , Radhakrishna Giduthuri , Kiriti Nagesh Gowda
CPC classification number: H04N13/117 , G06T3/4038 , H04N5/2254 , H04N5/2258 , H04N5/23238 , H04N5/247 , H04N13/204 , H04N13/243
Abstract: A method and apparatus of precomputing includes capturing a first image by a first image capturing device. An image space for the first image is defined and pixels in the image space are analyzed for validity. Valid pixels are stored as valid pixel groups and the valid pixel groups are processed.
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公开(公告)号:US10321052B2
公开(公告)日:2019-06-11
申请号:US15582460
申请日:2017-04-28
Applicant: Advanced Micro Devices, Inc.
Inventor: Michael L. Schmit , Radhakrishna Giduthuri , Kiriti Nagesh Gowda
Abstract: A method and apparatus of seam finding includes determining an overlap area between a first image and a second image. The first image is captured by a first image capturing device and the second image is captured by a second image capturing device. A plurality of seam paths for stitching the first image with the second image is computed and a cost is computed for each seam path. A seam is selected to stitch the first image to the second image based upon the cost for the seam path for that seam being less than a cost for all other computed seam paths, that seam is maintained as the selected seam for stitching based upon a predefined criteria.
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公开(公告)号:US10455211B2
公开(公告)日:2019-10-22
申请号:US15605474
申请日:2017-05-25
Applicant: Advanced Micro Devices, Inc.
Inventor: Michael L. Schmit , Radhakrishna Giduthuri , Kiriti Nagesh Gowda
IPC: G09G5/00 , H04N13/117 , G06T3/40 , H04N5/225 , H04N13/204 , H04N5/232 , H04N5/247 , H04N13/243
Abstract: A method and apparatus of precomputing includes capturing a first image by a first image capturing device. An image space for the first image is defined and pixels in the image space are analyzed for validity. Valid pixels are stored as valid pixel groups and the valid pixel groups are processed.
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公开(公告)号:US20180316851A1
公开(公告)日:2018-11-01
申请号:US15582460
申请日:2017-04-28
Applicant: Advanced Micro Devices, Inc.
Inventor: Michael L. Schmit , Radhakrishna Giduthuri , Kiriti Nagesh Gowda
CPC classification number: H04N5/23222 , H04N5/23238 , H04N5/23251 , H04N5/247
Abstract: A method and apparatus of seam finding includes determining an overlap area between a first image and a second image. The first image is captured by a first image capturing device and the second image is captured by a second image capturing device. A plurality of seam paths for stitching the first image with the second image is computed and a cost is computed for each seam path. A seam is selected to stitch the first image to the second image based upon the cost for the seam path for that seam being less than a cost for all other computed seam paths, that seam is maintained as the selected seam for stitching based upon a predefined criteria.
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