公开(公告)号：US20180114758A1

公开(公告)日：2018-04-26

申请号：US15334230

申请日：2016-10-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Sheng YAO ,  Huan Wun LI ,  Yu-Chih LEE ,  Wei-Hsuan LEE

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/482 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/4824 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor device package comprises a substrate, a first electronic component, first and second conductive pads, a first frame board, an encapsulation layer, and a conductive layer. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component, the first and second conductive pads, and the first frame board are on the first surface of the substrate. The first frame board surrounds the first electronic component and comprises a first conductive via and a second electronic component. The encapsulation layer encapsulates the first electronic component and the first frame board. The conductive layer is on the first frame board and the encapsulation layer. The first conductive via is electrically connected to the second conductive pad and the conductive layer, and the second electronic component is electrically connected to the first conductive pad.