公开(公告)号：US20190080975A1

公开(公告)日：2019-03-14

申请号：US15701394

申请日：2017-09-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hsuan LEE ,  Sung-Mao LI ,  Ming-Han WANG ,  Ian HU

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor device package includes a semiconductor device, a conductive bump, a first encapsulant and a second encapsulant. The semiconductor device has a first surface, a second surface and a lateral surface. The second surface is opposite to the first surface. The lateral surface extends between the first surface and the second surface. The semiconductor device comprises a conductive pad adjacent to the first surface of the semiconductor device. The conductive bump is electrically connected to the conductive pad. The first encapsulant covers the first surface of the semiconductor device and a first portion of the lateral surface of the semiconductor device, and surrounds the conductive bump. The second encapsulant covers the second surface of the semiconductor device and a second portion of the lateral surface of the semiconductor device.

公开(公告)号：US20180350753A1

公开(公告)日：2018-12-06

申请号：US16058844

申请日：2018-08-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hsuan LEE ,  Jaw-Ming Ding ,  Wei-Yu CHEN

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

Abstract: A semiconductor package device includes: (1) a substrate having a top surface; (2) a passive component disposed on the substrate and having a top surface; (3) an active component disposed on the substrate and having a top surface; and (4) a package body disposed on the substrate, the package body including a first portion covering the active component and the passive component, and a second portion covering the passive component, wherein a top surface of the second portion of the package body is higher than a top surface of the first portion of the package body, and the first portion and the second portion of the package body include different materials.

公开(公告)号：US20180114758A1

公开(公告)日：2018-04-26

申请号：US15334230

申请日：2016-10-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Sheng YAO ,  Huan Wun LI ,  Yu-Chih LEE ,  Wei-Hsuan LEE

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/482 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/4824 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor device package comprises a substrate, a first electronic component, first and second conductive pads, a first frame board, an encapsulation layer, and a conductive layer. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component, the first and second conductive pads, and the first frame board are on the first surface of the substrate. The first frame board surrounds the first electronic component and comprises a first conductive via and a second electronic component. The encapsulation layer encapsulates the first electronic component and the first frame board. The conductive layer is on the first frame board and the encapsulation layer. The first conductive via is electrically connected to the second conductive pad and the conductive layer, and the second electronic component is electrically connected to the first conductive pad.

公开(公告)号：US20180114757A1

公开(公告)日：2018-04-26

申请号：US15333008

申请日：2016-10-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hsuan LEE ,  Jaw-Ming DING ,  Wei-Yu CHEN

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16155 ,  H01L2224/48225 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/3025

Abstract: A semiconductor package device includes a substrate, a passive component, an active component and a package body. The passive component is disposed on the substrate. The active component is disposed on the substrate. The package body is disposed on the substrate. The package body includes a first portion covering the active component and the passive component, and a second portion covering the passive component. A top surface of the second portion of the package body is higher than a top surface of the first portion of the package body.

公开(公告)号：US20160240493A1

公开(公告)日：2016-08-18

申请号：US14625383

申请日：2015-02-18

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Wei-Hsuan LEE ,  Sung-Mao LI ,  Chien-Yeh LIU

IPC: H01L23/66 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L23/552

CPC classification number: H01L23/66 ,  H01L21/76838 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a semiconductor device, a plurality of electronic components, a first package body, a patterned conductive layer and a feeding element. The semiconductor device and the plurality of electronic components are disposed on the substrate. The first package body covers the semiconductor device but exposes the plurality of electronic components. The patterned conductive layer is formed on the first package body. The feeding element electrically connects the patterned conductive layer to the plurality of electronic components.

Abstract translation: 本公开涉及半导体器件封装。 半导体器件封装包括衬底，半导体器件，多个电子部件，第一封装体，图案化导电层和馈电元件。 半导体器件和多个电子部件设置在基板上。 第一封装体覆盖半导体器件，但暴露多个电子部件。 图案化的导电层形成在第一封装主体上。 馈电元件将图案化导电层电连接到多个电子部件。