公开(公告)号：US20180061767A1

公开(公告)日：2018-03-01

申请号：US15692947

申请日：2017-08-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuan-Feng CHIANG ,  Cong-Wei CHEN ,  I-Ting CHI ,  Shao-An CHEN

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/29 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/295 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/065 ,  H01L2224/19 ,  H01L2224/214 ,  H01L2224/96

Abstract: A semiconductor package structure includes a semiconductor substrate, at least one semiconductor die, an encapsulant, a protection layer, a plurality of conductive elements and a redistribution layer. The semiconductor die is disposed on the semiconductor substrate. The encapsulant covers at least a portion of the semiconductor die, and has a first surface and a lateral surface. The protection layer covers the first surface and the lateral surface of the encapsulant. The conductive elements surround the lateral surface of the encapsulant. The redistribution layer electrically connects the semiconductor die and the conductive elements.