公开(公告)号：US20180114757A1

公开(公告)日：2018-04-26

申请号：US15333008

申请日：2016-10-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hsuan LEE ,  Jaw-Ming DING ,  Wei-Yu CHEN

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16155 ,  H01L2224/48225 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/3025

Abstract: A semiconductor package device includes a substrate, a passive component, an active component and a package body. The passive component is disposed on the substrate. The active component is disposed on the substrate. The package body is disposed on the substrate. The package body includes a first portion covering the active component and the passive component, and a second portion covering the passive component. A top surface of the second portion of the package body is higher than a top surface of the first portion of the package body.

公开(公告)号：US20180350753A1

公开(公告)日：2018-12-06

申请号：US16058844

申请日：2018-08-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hsuan LEE ,  Jaw-Ming Ding ,  Wei-Yu CHEN

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

Abstract: A semiconductor package device includes: (1) a substrate having a top surface; (2) a passive component disposed on the substrate and having a top surface; (3) an active component disposed on the substrate and having a top surface; and (4) a package body disposed on the substrate, the package body including a first portion covering the active component and the passive component, and a second portion covering the passive component, wherein a top surface of the second portion of the package body is higher than a top surface of the first portion of the package body, and the first portion and the second portion of the package body include different materials.