公开(公告)号：US11276806B2

公开(公告)日：2022-03-15

申请号：US16734046

申请日：2020-01-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen Chiang ,  Kuang-Hsiung Chen ,  Lu-Ming Lai ,  Hsun-Wei Chan ,  Hsin-Ying Ho ,  Shih-Chieh Tang

IPC: H01L33/54 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/58 ,  H01L33/62 ,  H01L31/0232

Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.

公开(公告)号：US10436635B2

公开(公告)日：2019-10-08

申请号：US15267028

申请日：2016-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen Chiang ,  Hsin-Ying Ho ,  Hsun-Wei Chan ,  Lu-Ming Lai

IPC: G01J1/04 ,  H01L31/0203 ,  H01L33/54 ,  H01L33/58 ,  H01L31/0232 ,  H01L25/16 ,  G01J1/42

Abstract: An optical device includes an active optical component including an optical area, an encapsulant covering the active optical component, and a passive optical component adhered to the encapsulant above the active optical component. The passive optical component has an optical axis, and the optical axis is substantially aligned with a center of the optical area.